How can I measure the consistence of glue application in a Gemin

On the Gemini we had setup a starting an ending dots and had the camera verify them. I don't know if that is what you are looking for but hopefully that helps in some way.

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The cheapest method I've found to measure anything in that size range is a reticle for a stereo microscope. I don't remember the resolution but it was 2 or 5 mil, I think.

It's not rocket science but it's a nice tool for small scale measurements that doesn't break the bank. You could do dot diameter easily and with a little practice you could probably do height too, depending on the board size.

Other than that, an AOI system that can do paste should be able to see chipbonder too, but I've got zip for experience with those things.

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We wouldn't know a Gemini from a bread box, nor we are real clear on what you seek. So, we'll just rattle on for a while.

Here's how we monitor the quality of our dispensing process: * We dispense the same nonfunctional pattern of dots on every board [in addition to the functional dots that differ between products]. * If the pattern, spacing, and dot size are correct; we give the operator a cookie.

To us dispensing of chip bonder is a fairly unimportant production activity. It just needs to hold together until the board is soldered and not be so messy that it affects soldering processes. After that, who cares? Work on something important.

So before pushing on to the real important stuff, when you say, you're "getting a poor glue application in the smt process." What are we talking about?

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