yes, it could have been from all 3 locations. without any detail whatsoever about your process or anythign it is impossible to help!!
please check your incoming material prior to processing
please check your reflow profile to ensure that max temp is not exceeded
please check your placemnent machine to ensure that you have proper comp height in database
please check any board supports from any and all process and ensure proper location
please check wave process if applicable to ensure that the delta T is not excessive.
please ensure that depaneling if applicable is not fracturing components
please check paste application to ensure no shorting between pads or adjacent vias.
please check test equipment for excessive pin force or warping/bowing of board.
please check assembly to ensure that is clean in these areas.
All I can think of for now Russ
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