We are seeing unusual soldered joints when soldering to components with Pt/Ag metallised terminations. At the margin between the bottom of the component termination and the PCB surface there are a number of blowholes in the bulk solder. There also appears to be poor wetting to the end of the termination itself. We do not see this condition on any other component finishes on the same assembly.
The solder paste is SAC305 and the PCB finish is ENIG. Reflow is carried out in a vapour phase process with a maximum assembly temperature of 235 deg. C. Time above liquidus (217 Deg C.) is around 50 seconds.
I have requested feedback from the component manufacturer but it's like pulling teeth so in the meantime I an seeking your considered opinions.
reply »