Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


EPROM OR OTP ICs issues

Views: 3554

Muhammad Haris

#47424

solder paste ingredients and their effects | 9 February, 2007

What are Resins, Solvents, Activators, and Thickening Agents in Solder Paste and what are their helpful and harmful effects?

AND

What are the purposes/properties and effects of Sn(Tin), Pb(Lead), Ag(Silver), Bi(Bismuth), In(Indium), Cu(Copper), Ni(Nickel) and other elements in the composition of solder paste and with how much ratio, manufacturers put them in the composition of solder paste e.g. Sn63Pb37 and SAC305�then in Sn63Pb37 why 37 for Pb? (If any element�s composition is greater then is it useful/harmful to our solder paste/assembling or not?)

reply »

Muhammad Haris

#47425

EPROM OR OTP ICs issues | 9 February, 2007

1. Can X-Ray Inspection System damage the EPROM OR OTP during inspection after Reflow?

2. At 300 degree Centigrade, program in the EPROM OR OTP disturb. Is that true?

3. Sometimes, if some ICs couldn�t program first time then I put that IC in oven at 100 deg Centigrade for 1hr, after that few of them easily programmed. Why?

reply »

?

#47430

EPROM OR OTP ICs issues | 9 February, 2007

300 C Are you a quality engineer?

reply »

#47450

solder paste ingredients and their effects | 9 February, 2007

Ask Brain Toleno at "circuitsassembly.com/blog"

He's a smart guy and works as team lead at Henkel Loctite. Just don't take him out for drinks.

reply »

dphilbrick

#47451

EPROM OR OTP ICs issues | 9 February, 2007

These are lawyer questions!

reply »

#47452

EPROM OR OTP ICs issues | 9 February, 2007

Lawyer questions in the fact that they are silly or seem so vague?

"1. Can X-Ray Inspection System damage the EPROM OR OTP during inspection after Reflow?"

No, not by typical X-ray equipment designed for PCB manufacturing.

"2. At 300 degree Centigrade, program in the EPROM OR OTP disturb. Is that true?"

Not known without looking at manufacturers spec on the Eprom. 300 degrees C? You know that's pretty dang hot. I'd be scared the part would unsolder under that much heat.

"3. Sometimes, if some ICs couldn�t program first time then I put that IC in oven at 100 deg Centigrade for 1hr, after that few of them easily programmed. Why?"

Tolerance build up of the component.

reply »

dphilbrick

#47453

EPROM OR OTP ICs issues | 9 February, 2007

No, Muhammad is preparing for some type of trial, either a legal one or one by fire! These rank right up there on the absurdity scale. Got to be one or the other.

reply »

Fat Angry Engineer

#47454

EPROM OR OTP ICs issues | 9 February, 2007

That's my exact suspiscion too. This guy is trying to find some type of "scapegoat" for some unknown defect that nobody can figure out. First, he'll try blaming the solder paste, thinking that the CM is too dumb to choose the correct soldering material, and now this new-fangled alloy Steel-Titanium alloy mixed with a RMA flux, that the dumb CM is using is creating issues... Then.. he probably heard that the CM is doing X-Ray inspection and thinks that somehow, X-Rays will damage the innards of an IC. Next, he probably heard the term "burn-in" and took it literally.

Yup...I agree.. he screams Quality Engineer. I betcha he's "Six-Sigma-Blackbelt-Certified" too.

reply »

M.Haris

#47541

EPROM OR OTP ICs issues | 11 February, 2007

As i was using this forum first time thats why i wrote two questions Eprom or otp ics AND solder paste content at the same time. Basically i m a SMT Assy Engineer and i m the only one for buying the solder pastes from the vendors. if anyone feel those questions were stupid... i dont know why they are here.... either to resolve the issues or creating them.

reply »

#47560

EPROM OR OTP ICs issues | 12 February, 2007

"(If any element�s composition is greater then is it useful/harmful to our solder paste/assembling or not?)

It certainly changes the characterstics of the compound. Why you might change it depends on how you want it to behave. Be more or less ductile, brittle, pasty during reflow, aggressive, environmentally friendly, yadda, yadda, yadda.

Actually Pb is the savior for all things soldered, and must NEVER be reduced or eliminated. Lead-free is the evil antisolder and must be defeated at all costs.

reply »

Fluid Dispensers

Electronics Equipment Consignment