Thermal screening for marginal BGA joints

Subscribe to Thread

Hi experts, 1) Do you think a non-operating temperature c... - Nov 02, 2007 by yshiau

IPC-9701, SMT Solder Joint Reliability Qualification and Per... - Nov 03, 2007 by davef

I'm not sure what kind of marginal joint you're trying to id... - Nov 06, 2007 by ScottE

Thank you to Dave and Scott!! What I'm delaing with is ma... - Nov 09, 2007 by yshiau

yshiau

#52285

Thermal screening for marginal BGA joints | 2 November, 2007

Hi experts,

1) Do you think a non-operating temperature cycling would do good for screening some marginal BGA joints?

2) If yes, what the exterm temperatures I should go?

3) Any particular profile that is suitable for my need?

Thank you!!

reply »

davef

#52287

Thermal screening for marginal BGA joints | 3 November, 2007

IPC-9701, SMT Solder Joint Reliability Qualification and Performance Standard is an update of D-279, Design Guidelines For Reliable SMT PCA that includes BGA and PbFree

reply »

ScottE

#52329

Thermal screening for marginal BGA joints | 6 November, 2007

I'm not sure what kind of marginal joint you're trying to identify, but when we went through a serious ball-in-cup problem a few years ago we tried hot & cold functional test as well as a day or two of -40/+125C thermal cycling and all were pretty poor at identifying boards with bad joints. Without going back through my notebook, I'd estimate that each of these tests uncovered about 20% of the BGAs with ball-in-cup.

reply »

yshiau

#52444

Thermal screening for marginal BGA joints | 9 November, 2007

Thank you to Dave and Scott!!

What I'm delaing with is mass production test for small memory cards in volume!

The reason I choose Non-operating temperature cycling is so that I can deal with volume. I can throw in quite a few memory cards in chamber, cook them, and do my final system level test on MBs.

What I expect is to screen out some marginal BGA solder joints with head in pillow, improper wetting, partial opening, or even cold sodler issues.

Thank you very much with your input.

reply »