BGA replacement process

If you plan to reuse the BGA, you probably should bake the moisture from the component prior to removing it from the board.

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We always bake our loaded boards before any BGA rework is done. 12 to 16 hours at 100 c. We have had incidents in the past on loaded boards where 125 c has melted parts and the occasional low temp BGA trays. 100 c has proven safe for the past 10 years. Remember to remove any batteries from the board before baking.

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I don't think so if your process is a just in time rework, you have just to develop a profile at your rework station for each component and also clean the place (board) properly. If your process is not a JIT rework, you must have to bake the boards, also you can develop a controlled process with hummidity eliminators.

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