BGA soldering & BGA ball formation

I would not recommend doing BGA soldering with only a hot air gun. I have done it in the past, but the boards would eventually come back from the field because the solder joints did not form correctly and the BGA would have to be reworked again. In the event that I had to solder a BGA without a BGA rework station, I would at least want to have a bottomside board preheater so that I could preheat the PCB before I applied topside heat with a hot air gun. When I worked in manufacturering and our BGA rework station was down, we would apply solder paste using a stencil for the footprint for the BGA, place the part and then send the board back thru the reflow oven. That worked great. BGA ball formation, I am not familiar with

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With the gun you can do removal. Than clean the pads, put some flux, place new BGA(or reballed one) and put it in the reflow oven(if you have one). That's the cheap way you can go without buying an equipment. The other way is to buy machine for BGA repair(DenOn, Metcall, ERSA.....). Regards, Emil

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Do you mean BGA reballing? If so, then not with a hot air gun.

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thanks for your suggestions once again thanks

Vithal

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Hi,

yes, you can, but it will be subject to long learn curve where i live there are hundreds of GSM repair shops which do BGA rework and replacement with $50 hot air guns only, but i guess they had lot of BGAs damaged before they have learned how to do it right.

best regards Tsvetan

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