Printed Circuit Board Assembly & PCB Design Forum
SMT electronics assembly manufacturing forum.
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We are using a vapor phase oven which we have used successfu... - Aug 21, 2009 by ross
Dear Eric, in my opinion this is a very complex problem, ... - Aug 22, 2009 by Edoardo
Thank you for replying. 1) the finish is Gold Immersion (EN... - Aug 22, 2009 by ross
OK Eric, is difficult answer at distance without examine t... - Aug 23, 2009 by Edoardo
I don't think its an issue with the PCB. When we just put th... - Aug 24, 2009 by ross
OK Eric, maybe you're right. My suggestion is to proceed by ... - Aug 24, 2009 by Edoardo
Thank You for all your help. The PCBs are from the same ven... - Aug 24, 2009 by ross
Eric, use the TM 650 test method annexed. Don't forget to... - Aug 25, 2009 by Edoardo
It sounds like the BGA balls are not melting. You're probabl... - Aug 25, 2009 by davef
Do you know the exact BGA sphere alloy make-up and the alloy... - Aug 25, 2009 by Graham
Eric, the problem is a crack of the nickel PAD, or is a PILL... - Aug 25, 2009 by Edoardo
It appears that the crack is between the paste and the ball.... - Aug 25, 2009 by ross
The solder balls on this part are SAC105 (98.5 Sn, 1.0 Ag, 0... - Aug 25, 2009 by tstrat
Hi, as you are using Vapour phase reflow what temperature is... - Aug 26, 2009 by Graham
Ok Eric, finally we know that the problem should be the PI... - Aug 26, 2009 by Edoardo
I am not sure that it is the pillow problem. With the pillow... - Aug 26, 2009 by ross
I have already told you that is not possible solve this prob... - Aug 27, 2009 by Edoardo
Thank You for all your help. Eric ... - Aug 27, 2009 by ross
We recently had a very similar issue with BGA breaking off a... - Aug 27, 2009 by JIMnHKY
Thanks Jim. Can you tell me how you resolved/corrected th... - Aug 27, 2009 by ross
What is the boiling point of your vapour phase solvent ? ... - Aug 31, 2009 by Graham
We have tried 2. The first is 244C and the 2nd is 252C. Th... - Aug 31, 2009 by ross