suggest whether we can place BGA without Bals on PCB after Print

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BGA Rework. Pls suggest whether we can place BGA without Ba... - Nov 04, 2009 by Martin

It will be very difficult to apply the proper amount of sold... - Nov 04, 2009 by davef

Davef, We have BGA (removed from PCBA). We have Cleaned up... - Nov 05, 2009 by Martin

The solder joints might hook up but my opinion is you'll end... - Nov 05, 2009 by SWAG

Martin It might be possible to mount a deballed BGA as you ... - Nov 05, 2009 by davef

Martin

#60294

suggest whether we can place BGA without Bals on PCB after Print | 4 November, 2009

BGA Rework. Pls suggest whether we can place BGA without Balls on PCB after Printing. i.e without reballing if we mount BGA on PCB after Screen printing

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davef

#60316

suggest whether we can place BGA without Bals on PCB after Print | 4 November, 2009

It will be very difficult to apply the proper amount of solder with a stencil to bump a ball that is the proper size. A low volume ball is less reliable than a customary sized ball.

There are: * Reballing service providers * Reballing preforms * Forms that provide for the placement and soldering of loose solder balls.

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Martin

#60332

suggest whether we can place BGA without Bals on PCB after Print | 5 November, 2009

Davef, We have BGA (removed from PCBA). We have Cleaned up the pads. Instead of reballing can we directly mount on the Prime PCB like QFN.

Thanks Martin

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SWAG

#60335

suggest whether we can place BGA without Bals on PCB after Print | 5 November, 2009

The solder joints might hook up but my opinion is you'll end up with mechanically weak joints that could fail over time. If your trying to get your Xbox back on-line at home I'd try it but not if your charging $ to fix it for someone else or re-working something your selling.

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davef

#60336

suggest whether we can place BGA without Bals on PCB after Print | 5 November, 2009

Martin It might be possible to mount a deballed BGA as you mount a QFN. Thinking about doing it, it could be a lot more difficult than first thought. When you heat a BGA, it 'dances' on the board because of the different CTE of the materials involved. All that dancing easily could make it impossible to maintain good solder contact between the pads on the board and the pads on the interposer.

Certainly, it will not be as reliable as a BGA with solder balls.

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