Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

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Sheer strength of a BGA assembly

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RLM

#61768

Sheer strength of a BGA assembly | 5 May, 2010

Has anyone ever run across a specification for the sheer strength of a soldered BGA assembly. We are looking to qualify a process and would like to have a target number to shoot for.

Thanks

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#61772

Sheer strength of a BGA assembly | 6 May, 2010

There is no specification. Shear tests are very material / operator dependent.

BALL SHEAR TESTING OF RAW BGA DEVICES: A total of 3 devices were subjected to ball shear testing. Results of the testing indicated shear values in the range of 0.7-1.25 Kg per ball . Inspection of the balls revealed that the balls cleanly sheared from the substrate while pulling up all of the metallization from under the ball, see photodocumentation for typical examples (the ball lifts were identical to that observed on the temp cycled devices). [Analytical Solutions, Inc.]

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