Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


LGA Rework

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#62323

LGA Rework | 27 July, 2010

Recently we have been placing and reworking quite a few Linear LGA DC converter modules. These are LGA packages with integrated passive components which become easily disturbed in reflow. Even with perfect bumping techniques on the LGA using the polyimde stencils unless the reflow profile is perfect the yields are much below normal.

Anyone share other ideas that have been tried?

Bob BEST Inc

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Capillary Underfill process

Reflow Oven