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Yestech B3 Capacitors and P+P downtime

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#64081

Yestech B3 Capacitors and P+P downtime | 5 April, 2011

Hi

Recently I have been set the task of increasing the amount of time our pick and place machines (Mirae MPS-1025P) are running for. I am fairly new to CEM and have found that the main reason the machines are offline for so long is that the operators are conducting a manual first off inspection for the first board to come off the p+p machine. We do have a Yestech B3 AOI machine which is currently being used for final inspection. When I asked why this is not being used to conduct the FAI the operators said it was unable to detect chip capacitors as these have no markings. Does anyone know if there is a way in which the AOI machine can be used to conduct FAI quickly and accurately? Also if anyone has any advice on reducing p+p downtime in general that would be very useful. I looked at applying SMED and 5S to reduce changeovers along with a VOP to detect quaality issues but not much else. Thanks.

Don

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FRC Dave

#64084

Yestech B3 Capacitors and P+P downtime | 5 April, 2011

Hi Don, The YESTech B3 can be used post placement very easily. I would suggest contacting their service team, they could walk you through the process quickly.

You are actually very close to being able use it now in that capacity since you have the inspection program written to inspect post oven. You just need to remove the solder inspection boxes from the current program and save it as a different file name.

The system does move your pcb in the Y direction and the Camera/ Light assembly moves in the X, so you may need to slow down the acceleration and deceleration of the system some so that you don’t move parts, but the AE’s will help you figure that part out.

Your operator is correct in that the system will not be able to tell you the different values of capacitors of the same color as they are not marked, but this is a limitation in manual inspection also, right? You will still need to manually verify that the correct reels are loaded into the correct spots on the P+P system.

Call the service team at YESTech, they can walk you through it quickly.

Good Luck.

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#64098

Yestech B3 Capacitors and P+P downtime | 6 April, 2011

Thanks Dave

Iam in the process of contacting yestech support and arranging trainning for me and the operators on the line. Thanks.

DOn

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Reese

#64112

Yestech B3 Capacitors and P+P downtime | 7 April, 2011

What version of sw are you running? There are some new features in 2.7.7 and earlier that may be of benefit to you. With chip caps you are testing for presense/absense. The gain/offset feature can be used to give you better contrast between the part body and the pcb background. Binarized imaging is another possibility but a lot of that will depend on your use of silkscreens. This will often interfere with such algorithms. You just have to toy with it to find the best inspection algorithm for your product. Forget color inspection. This is useless with brown body parts and I have never had any success with it. YesTech may tell you to give it a try, but you probably won't have any luck with it. I have also tried using just solder inspection. This will catch some missing parts, but not all. It just depends on the application of the solder, but I do not recommend you use this for presense/absense detection by itself. You can also use an array of different algorithms for one part by using layers and ORing them. I believe the new sw supports up to 5 now.

Of all these suggestions, I have had much better success with the gain/offset feature. Our silkscreen layout has prevented consistent results with binarized imaging.

I hope this helps. Good luck.

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#64128

Yestech B3 Capacitors and P+P downtime | 8 April, 2011

Thanks Reese.

To be honest I don't know a great deal about the software just yet but we are running version 2.7.4. I know the guys are saying that they have a problem with identifying small capacitors and resistors as these have no markings though they are currently using colour inspection. Also tombstoning is not able to be identified on a lot of components either. Thanks for the input and Il try these new methods as well.

Don

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