BGA Thermal Profiling

Do you have Kic or Mole? K You can call Kic and then can help you. You can attach to the top of the BGA. There was an article in one of the last few circuits assembly mag that should help you.

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Try a probe at two corners (opposing) and one on top. Provided your corners are getting comforatably into reflow temperatures, the middle should as well.

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* Attaching thermocouple to CSP or BGA is a challenging task. Usually a hole is drilled at the center and the thermocouple is routed through the bottom of the board and to the area of interest. In particular, since the CSP stand off is very small, a tunnel is milled next to the drilled hole and connected to the pad .This will allow the thermocouple to sit flush with the board. An easier method is to drill on the pad and attach the thermocouple from the bottom directly to the ball. [Intel]

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Saw this at Circuitmart.com last year. http://www.circuitmart.com/mart/50930D.shtml

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We have been developing profiles for BGA process going on 14 years now. We have never had to drill holes or resort to any type of destructive methods for BGA assembly, rework or defect analysis. Depending on requirements, i.e BGA rework or BGA assembly. We place thermocouples at desired locations and estimate the heat differential to determine solder ball temperature. We have 100% yield and do not require solder samples. Contact me if you wish to discuss in more detail.

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i used to remove one-two columns of the balls leading to the centre of the BGA then slide thermocouple inside. Of course it is highly dependable on your BGA clearance. janz

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