> J-STD-003B prescribes test methods, defect > definitions and illustrations for assessing the > solderability of printed board surface > conductors, attachment lands, and plated-through > holes utilizing either tin/lead or lead-free > solders. This standard is intended for use by > both vendor and user. The objective of the > solderability test methods described in this > standard is to determine the ability of printed > board surface conductors, attachment lands, and > plated-through holes to wet easily with solder > and to withstand the rigors of the printed board > assembly processes.
> J-STD-003B prescribes test methods, defect > definitions and illustrations for assessing the > solderability of printed board surface > conductors, attachment lands, and plated-through > holes utilizing either tin/lead or lead-free > solders. This standard is intended for use by > both vendor and user. The objective of the > solderability test methods described in this > standard is to determine the ability of printed > board surface conductors, attachment lands, and > plated-through holes to wet easily with solder > and to withstand the rigors of the printed board > assembly processes.
> J-STD-003B prescribes test methods, defect > definitions and illustrations for assessing the > solderability of printed board surface > conductors, attachment lands, and plated-through > holes utilizing either tin/lead or lead-free > solders. This standard is intended for use by > both vendor and user. The objective of the > solderability test methods described in this > standard is to determine the ability of printed > board surface conductors, attachment lands, and > plated-through holes to wet easily with solder > and to withstand the rigors of the printed board > assembly processes.
> J-STD-003B prescribes test methods, defect > definitions and illustrations for assessing the > solderability of printed board surface > conductors, attachment lands, and plated-through > holes utilizing either tin/lead or lead-free > solders. This standard is intended for use by > both vendor and user. The objective of the > solderability test methods described in this > standard is to determine the ability of printed > board surface conductors, attachment lands, and > plated-through holes to wet easily with solder > and to withstand the rigors of the printed board > assembly processes.
Hello, generally speaking, within 6 months is available
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