Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Solder Ball Composition

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#68738

Solder Ball Composition | 25 April, 2013

Hi, I have a BGA ball with composition 98.3Sn 1Ag 0.7Cu Does anyone know what is the effect if I increase or decrease the amount of Sn, Ag, or Cu? And what if I add Ni inside? Can anyone explain to me? Many thanks in advance.

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#68743

Solder Ball Composition | 25 April, 2013

Hi,

I attach two pictures for you. Hope they help

Attachments:

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#68745

Solder Ball Composition | 25 April, 2013

Hi, thanks for the pictures. May I know in the first picture what are those numbers (i.e. 280, 290, 300, 310, etc) represent?

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#68748

Solder Ball Composition | 26 April, 2013

These numbers show liquidus temperature in C for each alloy combination.

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