What methods do you use for final packaging? Bubble Wrap, bags, trays? Anything unique?

Hi All,

I've been in the CM world for a long time and it seems like there has been little change in the packaging techniques used at the end of the day.

Assembled circuit boards in small/flex volume are bagged or bubble wrapped and boxed up to ship (if not going into an upper level assembly). Larger volume can use clam shells, reusable carriers or sometimes still go with the bubble wrap and box. Lots of manual labor and sometimes not enough thought is put into it.

Is there anyone using anything automated or semi automated in the assembly protective packaging of assembled circuit boards?

Anyone making their own bubble wrap on site?

My thought is one could possible heat seal bubble wrap around an assembly, similar to a shrink film but without the shrink. Having an easy and more efficient way of packaging than tearing off sheets of bubble all day.

What methods do you currently use? Any new ideas?

Open for input and conversation.

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