SUPPLIERS: * Sonix 8700 Morrissette Dr Springfield, VA 22152 (703) 440-0222 ext 155 fax 9512 John Goings * Sonoscan 2149 E Pratt Blvd Elk Grove Village IL 60007 800.950.2638 630.766.7088 fax 4603 http://www.sonoscan.com info @sonoscan.com John Ippen (sales x247) Ray Thomas (contract x245)
SERVICE PROVIDERS: Don�t forget that suppliers offer service work.
MORE: * An article in �Journal Of Surface Mount Technology� that had some coo SAM [surface acoustic microscopy] pix of BGA ball cracking, but I cannot find it. I believe the article was on �black pad�. Try a search of the �knowledge base� at SMTA [http://www.smta.org]. * �Electronic Failure Analysis Handbook� Martin, PL, McGraw-Hill has a chapter on using acoustic imaging to analyze failures in electronic packages. * Google [http://www.google.com] tosses-up almost 15,000 hits on �acoustic microscopy�.
FINAL NOTE: Like the 5DX, SAM is not an in-process inspection tool. It will confirm cracked BGA balls or package cracks. [They glow white, coo!!!] Shortly there after, you'll need to be pouring epoxy and lighting-up the saws and grinders to see / understand what's happening. While I don't expect you to be running-out to purchase one of these pups, you time might be better spent doing a quick analysis, some sections [probably, you could just pop that dude off with a screw driver] and then diving into fighting the cause of the problem.
What kind of solderability protection is on your board? What's on the BGA interposer?
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