BGA Pre and Post Soldered Height Tolerances

I know there are a ton of variables that affect the overall height of a BGA after soldering to a PWB but...

I'd like to know if anyone has done an analysis of (or if it's documented) as to what the pre and post reflow height dimension as measured from the top surface of a BGA to the top surface of the PWB after the BGA "settles down" during the reflow process? What are the tolerances seen within this measurement?

I know what you're all thinking, don't ask ;-)

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