For Linear Tech LGA's we solder bump the LGA using a .30mm solder ball then reflow with a tacky flux. This will provide a void free solder joint and adds a little height to the solder joint in case you use a flux that you want to clean from under the BGA.
We use Amtech 4400 mildly active tacky flux. This is good for Lead Free Solder and washes out easily with warm water. For a No Clean Tacky Flux we use Kester RF-741.
We also make custom fixtures that can solder bump 9 to 12 LGA at a time if you have a lot of LGA's to bump.
Best makes Kapton Stencils that you can apply solder paste to the LGA or PCB and reflow to make a solder bump also or just install the LGA with Solder Paste. The disadvantage of installing LGA's and QFN's using solder paste is that you will always have some voids.
You can see our reballing demo here: https://youtu.be/7-M65u74oSo
We are a supplier of Reballing Fixtures, Solder Balls, Reballing Stencils, Amtech Fluxes, Chip Quik Products, JBC Soldering Stations, and BGA Rework Stations. We also have a large inventory of SRT Nozzles and provide SRT Service, Repair and Operator Training.
reply »