BGA

We might be doing a job with some plcc, soic on one side and the other side will have two BGA's. Does any one have any ideas on what knid of problems that might occur if we reflowed both sides? Like heat temp, surface tension, etc. Thanks for any help we can get.

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| We might be doing a job with some plcc, soic on one side and the other side will have two BGA's. Does any one have any ideas on what knid of problems that might occur if we reflowed both sides? Like heat temp, surface tension, etc. Thanks for any help we can get. | It depends on the size of the plcc. PLCC44s hang on pretty well. Above that, you'll have to revert to the old formula. I think the rule is 1g per square micro inch of contact area but I'm not sure. the SOIC's will be no problem. I process a lot of assemblies requiring double sided reflow and continue to be amazed at what surface tension will hold onto. Check out www.ITM-SMT.com, I believe there is an article on surface tension.

Regards, Justin Medernach

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