Wave Soldering 14 and 16 Pin SOICs

We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce bridging. Can anyone share their experience in setting up the wave solder process to avoid thermal damage to the part. What is the optimal temperature profile for wave soldering such components? My optimal profile is currently 2 degree C per second (measured on the bottom) with a pot temperature of 480C using the Chip and Lambda waves with organic flux.

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| We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce bridging. Can anyone share their experience in setting up the wave solder process to avoid thermal damage to the part. What is the optimal temperature profile for wave soldering such components? My optimal profile is currently 2 degree C per second (measured on the bottom) with a pot temperature of 480C using the Chip and Lambda waves with organic flux.

Hi Stan, in a previous life (previous company) we wave soldered 14-pin SOIC's using a very archaic (1983 model) Econopak 229, WITHOUT a hot-air debridging knife. Like you, we used a chip and lambda wave, and we used a temp. profile with a ramp-up of around 2 deg C/s which are the requirements of most Ceramic Caps. Temps. before the wave were in the 240-260 deg. F range. At this temperature, no damage was done to the part. We did experience some bridging, but not that much.

Try to retrofit a hot-air debridging knife on your wave (if possible). This should eliminate bridging. |

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