Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Tenting of vias

Dave Hulbert

#14660

Tenting of vias | 18 August, 1998

Hello, > I have a question on tenting of vias on PWB's. I have designed a 6 >layer, military, mixed components (all on top side), LPI soldermask >board which will be run over the wave. I was planning on tenting vias >but did not specifically specify that on fab drawing. What we got back >is basically a board where all the vias are SMOBC. Does anyone have an >opinion on the board we recieved. Is tenting of vias really required? >Has the electrical integrity been compromised? > Any help/input will be greatly appreciated. Thanks, >

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Bill Childs

#14661

Re: Tenting of vias | 31 August, 1998

| Hello, | > I have a question on tenting of vias on PWB's. I have designed a 6 | >layer, military, mixed components (all on top side), LPI soldermask | >board which will be run over the wave. I was planning on tenting vias | >but did not specifically specify that on fab drawing. What we got back | >is basically a board where all the vias are SMOBC. Does anyone have an | >opinion on the board we recieved. Is tenting of vias really required? | >Has the electrical integrity been compromised? | > Any help/input will be greatly appreciated. Thanks, | >

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Dual Lane Reflow Oven

Capillary Underfill process