| Dear collegues, | I like to have your comments/ experience with various methods of depanelization like routing, scoring, cutting etc. | Any feed back on the equipment used with company addresses will be highly appreciated. | Please identify if possible source of articles/papers/literature on merits and demerits of each panelization method. Thanks | RIZVI
Rizvi: The five major technologies for depaneling boards are: 1 Routing: No restriction on board shape. Clean edge on board. Fairly fast, but dirty and noisey and more complex. Used machines can be purchase for about $20k. Sources are: cencorp 303.530.0891 and 0Z0 Automation Router 800.366.0401 2 Scoring: Requires straight edges on board. Fairly fast manual process that could be time consuming, depending on the layout. Can put stress on solder joints near the score. Requires no special tooling. Manual machinery is relatively inexpensive ($10k). Sources are: Radoll Designs 912.228.0200 and CAB Technology Westfield, MA 978.392.3459 fax 3601 3 Singulation: Fast, accurate, clean edge, but requires fairly expensive ($50K) machine and dedicated tooling. Wand 708.459.2400fax2421 and Circuit Technology 708.705.2140fax2141 are two suppliers. 4 Snap-Off: Low cost, but leave rough edge and requires 3/8" clearance around "mouse bites." 5 Shearing: leaves smooth edge, but needs a straight edge that is clear of components and features. Just to get started, checkout the earlier thread, listed below, on depaneling. Dave F
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