Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Re balling BGA

Earl Moon

#15760

Re balling BGA | 22 May, 1998

I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). Earl Moon

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Dave F

#15763

Re: Re balling BGA | 24 May, 1998

| I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | Earl Moon Earl: We send the BGAs to a service "re-baller." Dave F

PSI, 16833 FM 1431 #E3, Leander TX 78641 512.267.3143 fax4619

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Justin Medernach

#15765

Re: Re balling BGA | 26 May, 1998

| | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | Earl Moon | Earl: We send the BGAs to a service "re-baller." Dave F | | PSI, 16833 FM 1431 #E3, Leander TX 78641 512.267.3143 fax4619 Hey Earl, You'll find that this is a process specific type of operation. How many are being reworked? How expensive are the components? How large are they? There is so much equipment out there and it's all silly. As far as reballing, I don't do it. We send it out. The reballing process is highly debateable. I have heard of guys who are screening paste back onto the BGA and reflowing it. Whala, re-balled BGA. Most people are using a conductive epoxy / ball attach or solder paste, depending on the type of package. Most of the reballing stations are pretty standard, over-priced pieces of #@%!. You can make the equivalent or something better in your garage. As for rework stations, that's where the snowjob lies. Yeah, come and get me Airvac, Conceptronics, and SRT. These are pretty much the big boys in the game. Their systems cost around 60k give or take 20k. Your best bet is to apply that 20k buffer to the high side of the price range because after all the nozzles and retrofits are included, you got yourself one expensive dust collector. Bottom side preheaters are never adequate. Take that to the bank. Vision / optics are fairly standard and well developed. Placement technology / methodology is mature. Basically, it's the heat that's lousy. These things just don't have the oomph required for a good profile. I know of people using cold solder paste on the SRT units because the preheat is so long that all the flux is gone by the time the board is in the soak stage. Maybe they have corrected this by now but I haven't heard anything. The big deal with these machines is you pay 60k to 80k for one and you can't give the thing away a year later. The problem is, you need one. You basically need a system with global bottomside preheaters. Nothing localized. They're out there but they can cause your board to bend in ways you never thought possible. Preheating on a hot plate and then transferring to the machine is a better bet. I know more about 'em but I don't want to slam these guys. My e-mail is hosed for now. It's been out for a week. You can call me to chat. My direct line is 978 392 3218. best regards, justin

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Earl Moon

#15766

Re: Re balling BGA | 26 May, 1998

| | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | Earl Moon | | Earl: We send the BGAs to a service "re-baller." Dave F | | | | PSI, 16833 FM 1431 #E3, Leander TX 78641 512.267.3143 fax4619 | Hey Earl, | You'll find that this is a process specific type of operation. How many are being reworked? How expensive are the components? How large are they? There is so much equipment out there and it's all silly. As far as reballing, I don't do it. We send it out. The reballing process is highly debateable. I have heard of guys who are screening paste back onto the BGA and reflowing it. Whala, re-balled BGA. Most people are using a conductive epoxy / ball attach or solder paste, depending on the type of package. Most of the reballing stations are pretty standard, over-priced pieces of #@%!. You can make the equivalent or something better in your garage. As for rework stations, that's where the snowjob lies. Yeah, come and get me Airvac, Conceptronics, and SRT. These are pretty much the big boys in the game. Their systems cost around 60k give or take 20k. Your best bet is to apply that 20k buffer to the high side of the price range because after all the nozzles and retrofits are included, you got | yourself one expensive dust collector. Bottom side preheaters are never adequate. Take that to the bank. Vision / optics are fairly standard and well developed. Placement technology / methodology is mature. Basically, it's the heat that's lousy. These things just don't have the oomph required for a good profile. I know of people using cold solder paste on the SRT units because the preheat is so long that all the flux is gone by the time the board is in the soak stage. Maybe they have corrected this by now but I haven't heard anything. The big deal with these machines is you pay 60k to 80k for one and you can't give the thing away a year later. The problem is, you need one. You basically need a system with global bottomside preheaters. Nothing localized. They're out there but they can cause your board to bend in ways you never thought possible. Preheating on a hot plate and then transferring to the machine is a better bet. I know more about 'em but I don't want to slam these guys. My e-mail is hosed for now. It's been out for a week. You can call me to chat. My direct line is 978 392 3218. | best regards, | justin Justin, Thanks for the great input. Obviously nothing has changed except the rhetoric. Wondered where you had been. Thought you were on vacation or honey= mooning with your new future ex wife. Enough wise comments. Good to see from you again. Earl Moon

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Justin Medernach

#15767

Re: Re balling BGA | 27 May, 1998

| | | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | | Earl Moon | | | Earl: We send the BGAs to a service "re-baller." Dave F | | | | | | PSI, 16833 FM 1431 #E3, Leander TX 78641 512.267.3143 fax4619 | | Hey Earl, | | You'll find that this is a process specific type of operation. How many are being reworked? How expensive are the components? How large are they? There is so much equipment out there and it's all silly. As far as reballing, I don't do it. We send it out. The reballing process is highly debateable. I have heard of guys who are screening paste back onto the BGA and reflowing it. Whala, re-balled BGA. Most people are using a conductive epoxy / ball attach or solder paste, depending on the type of package. Most of the reballing stations are pretty standard, over-priced pieces of #@%!. You can make the equivalent or something better in your garage. As for rework stations, that's where the snowjob lies. Yeah, come and get me Airvac, Conceptronics, and SRT. These are pretty much the big boys in the game. Their systems cost around 60k give or take 20k. Your best bet is to apply that 20k buffer to the high side of the price range because after all the nozzles and retrofits are included, you got | | yourself one expensive dust collector. Bottom side preheaters are never adequate. Take that to the bank. Vision / optics are fairly standard and well developed. Placement technology / methodology is mature. Basically, it's the heat that's lousy. These things just don't have the oomph required for a good profile. I know of people using cold solder paste on the SRT units because the preheat is so long that all the flux is gone by the time the board is in the soak stage. Maybe they have corrected this by now but I haven't heard anything. The big deal with these machines is you pay 60k to 80k for one and you can't give the thing away a year later. The problem is, you need one. You basically need a system with global bottomside preheaters. Nothing localized. They're out there but they can cause your board to bend in ways you never thought possible. Preheating on a hot plate and then transferring to the machine is a better bet. I know more about 'em but I don't want to slam these guys. My e-mail is hosed for now. It's been out for a week. You can call me to chat. My direct line is 978 392 3218. | | best regards, | | justin | Justin, | Thanks for the great input. Obviously nothing has | changed except the rhetoric. Wondered where you had been. Thought you were on vacation or honey= | mooning with your new future ex wife. Enough wise | comments. Good to see from you again. | Earl Moon Yup, Back in business. I was out in Chicago for a Siemen's training program, then I had to de-install the old equipment, then there was the acceptance of the new toys, now there is the de-installation of some more equipment. I'm glad I got that degree... Cheers, Justin

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Allen

#15762

Re: Re balling BGA | 31 May, 1998

I came across your question and have a good reply for you: We have been using a system to reball our BGA's made by a company called Galahad. They have been working with Hepco for distribution. Give them a call at 408-738-1880. The system is around 6k but works great. setup is a few seconds and it is essentially a hand held pick and place machine. I heard Motorola is using this in place of other equipment because you can bump 1 to 6 component at atime. Hope I am of some help. Allen

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Eric

#15764

Re: Re balling BGA | 31 May, 1998

Earl, I am not sure of your specifc application but we have a good system to easily reball your BGA's E-mail me at bgakit@concentric.net for more information. Thanks, Eric

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Dave F

#15761

Re: Re balling BGA/Pad Dressing Methods | 2 June, 1998

| I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | Earl Moon What methods do people use to dress pads after removing and before replacing the BGA? We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? Dave F

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Brian

#15768

Re: Re balling BGA/Pad Dressing Methods | 1 April, 1999

B: Edsyn make a nice tool to Solder Dress, check out the TSX-70. It'll blow and suck at the same time!

| | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | Earl Moon | What methods do people use to dress pads after removing and before replacing the BGA? | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | Dave F

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Reflow Oven

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