solder paste in Flipchip

In solder bumping in flipchip technology by splder printing, the precise control of solder volume and height is very difficult. Therefore I'd like to know the solution of this problem. Thanks

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| In solder bumping in flipchip technology by solder printing, | the precise control of solder volume and height is very difficult. | Therefore I'd like to know the solution of this problem. | Thanks

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You are right !!! The exact volume of solder paste onto flip chips is extremely critical. Only one vendor that I know has taken that part of the process to the next level, whereby they can effectively deposit the right amount onto the flip chip exactly where you need it. Their name is AMTX. The have produced some wafer bumping stencils that would absolutely blow your mind. They use a patented process called 'Electroforming'. If you would like some more information then contact Dick Clouthier at 716-396-6974. They are on Eastern time in Upstate New York. Good luck!!! JON Gruett | In solder bumping in flipchip technology by splder printing, | the precise control of solder volume and height is very difficult. | Therefore I'd like to know the solution of this problem. | Thanks

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