SOLDER AND REWORK OF BGA

I manufacture industrial ink jet printers. I have a new application to join an unpopulated flex circuit to a light ly populated PCB. Production requirements are rather low. The area To join is 300 solder balls on the flex occupying an area of 5/8 inch by 3 inch. This area also needs to be unsoldered and flex removed when rework opportunities arise. Any ideas on the best way to do this? I have hot bar bonders available but bar size appears to be a possible problem. Appreciate any help.

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