BGA & PCB - solderability issue

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Hello Experts We ran into problem today when one of the b... - Aug 29, 2002 by Yngwie

Sounds like hyper-corrosion of nickel, commonly referred to ... - Aug 29, 2002 by davef

How to accessthe journal of SMT ? ... - Aug 30, 2002 by Yngwie

'Journal Of Surface Mount Technology' is published by SMTA. ... - Aug 30, 2002 by davef

We have found the same problem recently. Is there somewhere... - Sep 06, 2002 by mhunter

To check any solder crack, open under the BGA/CCGA. I am us... - Sep 06, 2002 by Dason C

I think an image gallery would be great if it exists please ... - Sep 09, 2002 by Kevin Facinelli

Yngwie

#21353

BGA & PCB - solderability issue | 29 August, 2002

Hello Experts

We ran into problem today when one of the board that we assembled having problem at Test, BGA failure. The joints looks good but no continuity. When trying to remove the BGA, i found that the pad on the PCB is intact but black in colour/ or turnish ? very smooth and no sign of solder wetting on it. Could it due to the problem from the PCB fabrication process, like nickel got oxidized before the plating process ?

Pls shed some light. Thank you.

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davef

#21354

BGA & PCB - solderability issue | 29 August, 2002

Sounds like hyper-corrosion of nickel, commonly referred to as 'black pad', in ENIG solderability protected boards. Search the fine SMTnet Archives to get started.

Additionally, the July - September 2002 'Journal Of Surface Mount Technolgy' has an article on 'black pad' that might be worth your time.

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Yngwie

#21375

BGA & PCB - solderability issue | 30 August, 2002

How to accessthe journal of SMT ?

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davef

#21382

BGA & PCB - solderability issue | 30 August, 2002

'Journal Of Surface Mount Technology' is published by SMTA. [Check the fine SMTnet Archives for links to SMTA.]

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mhunter

#21427

BGA & PCB - solderability issue | 6 September, 2002

We have found the same problem recently. Is there somewhere that I can post images to, for additional observational opinions.

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Dason C

#21428

BGA & PCB - solderability issue | 6 September, 2002

To check any solder crack, open under the BGA/CCGA. I am using a destruction test to find out is it related to the reflow profile or the Fab issue.

1. Depense the Dye (I use Dykem Steel Red) under the device. 2. Cure the dye 3. Remove the device 4. Inspect the area, if you find any red on the pad, oops.

Rgds.

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Kevin Facinelli

#21457

BGA & PCB - solderability issue | 9 September, 2002

I think an image gallery would be great if it exists please let me know

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