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Direct Chip Attached & Flip Chip

Yngwie

#22965

Direct Chip Attached & Flip Chip | 10 January, 2003

We are typical SMT subcontracting house. Recently I received RFQ for brds with DCA or Flip Chip technology.

In our factory we only have typical SMT machines i,e Printer-HSP chipshooter-GSM IC placer-reflow oven. What are additional machines and processes need to be added vs normal SMT process ? IS there any new machines needed ?, if so what are they ? On the Flip-Chip pick-up do I need special nozzles ? Do I need to invest on special vision's camera ?

I would appreciate it if any of you could also provide me a link to the articles of FlipChip process setup and any critical/potential problem that I should be focused on.

Thank you...

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mk

#22975

Direct Chip Attached & Flip Chip | 10 January, 2003

www.sipad.com/Motorola/MotorolaFlipChip.htm

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rboulanger

#23295

Direct Chip Attached & Flip Chip | 6 February, 2003

You can upgrade GSM machines to process flip chips. Yes, you do need special software and nozzles and probably a new camera with more resolution.

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MA/NY DDave

#23298

Direct Chip Attached & Flip Chip | 6 February, 2003

Hi

You already have some good answers. Let me add just a little of what I know.

You might want to check the IPC and obtain their guides on this technology. Also SMTA, NEPCON and others have technical proceedings on this technology.

Checking with each equipment mfg is also a good idea Yes including Universal (UIC).

For some of the Flip chips you might need some new equipment like XRay or Sonoscan (acoustic microscopes).

If you have a fairly average to tough flip chip you might need to hire a consultant to help you over new developments and go to a steady process as soon possible.

YiEng, DDave

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