Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Rework Procedures

John S

#24601

Rework Procedures | 27 May, 2003

Can anyone provide information on acceptable temperature control for SMT and Through hole rework? I've found IPC's guidelines, but I didn't see any specific temp guidelines. Our component vendors are being silent as usual. Thanks in advance, John S.

reply »

#24605

Rework Procedures | 27 May, 2003

Our solder irons are tuned to 700*F, but the in-use temperature varies according to the solder alloy and the characteristics of the board and components.

Check some of the papers on multilayer ceramic capacitors. They get fairly specific, for instance: * http://www.vishay.com/capacitors/ceramic-multilayer/

* http://www.chemi-con.co.jp/english/support/cera_note_e.html

* http://www.europechemicon.de/ecc01/Products/ceramics/ce-precaution-e-010928.pdf

* http://www.jaro1.com/1043spec/Capacitors/Surface%20Mount/Ceramic%20Multilayer/Standard%20and%20high%20voltage%20series%20notes.pdf

reply »

Benchtop Fluid Dispenser

Reflow Oven