BGA Thermal Cycling Tests?

We are looking for recommendations on reliability testing (thermal cycling, vibration, etc.) of BGAs AFTER being soldered to a PCB. Are there any standards that include such things as heating cycles (like a minimum of 5,000 cycles), ball-ball leakage and the like? Can anyone share this kind of information that they may have gotten from an IC vendor or by other companies that can be/should be used as a benchmark?

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