Lead Free Sn-8Zn-3Bi Solder Paste

Major Japanese OEMs investigated numerous lead-free alternatives, including alloys containing bismuth and/or zinc, such as Sn/Ag/Bi/Cu, Sn/8Zn/3Bi and Sn/58Bi. However, over time, the Japanese industry has moved toward Sn/Ag/Cu alloys. The Japan Electronics and Information Technology Industries Association (JEITA) recently recommended the Sn/3.0Ag/0.5Cu alloy, partly due to concerns over patent issues. However, cross-licensing of nearly all the Sn/Ag/Cu family of solder alloys now appears complete, meaning all formulations are available from most solder suppliers. Accordingly, alloy selection should be driven by overall performance in product applications.

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> Hi, > > Has anyone had any experience with lead > free Sn-8Zn-3Bi solder paste? Apparently in Japan > it's becoming popular because it's got a melting > point of below +200C. > > Can anyone confirm that, > or does anyone have experience with > it? > > Regards, > > Grant

I had been use Sn8Zn3Bi solder paste in NB OEM TW factory 3 years ago. Solder is base on Japen company recommand. As you knows,the best advantage is low temperature melting point 198~199 C. if you choice "Pin-in-Paste" for your PCBA, Sn8Zn3Bi maybe is easy solution. But SZB have many many issue, ex: powder more easier to oxidize;more dull image in AOI & AXI;lower reliability character(SnPbBi) if your products cannot compliance 100% Pb-Free....etc. In my opioion , suggest you could choice SAC for SMT, SnCu for Wave solder. FYR~

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Consider the availability and the cost of the product. SN/AG/CU is going to be the lead free choice from what I understand. Thus the distributors will be purchasing this formulation in volume thus reducing cost per gram. You get into something that is not of the norm you will be paying more money.

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