Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Type 3 powder with BGA

#32530

Type 3 powder with BGA | 9 February, 2005

Does anyone know the smallest pitch I can print succesfully with type 3 powder for a BGA ?

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#32791

Type 3 powder with BGA | 21 February, 2005

You want approximately 5 particles minimum across the smallest aperture.

So in the case of a 0.8mm device, we use .017" pads with a round 0.020" aperture on a 6 thou thick stencil foils. Here, 0.020" diameter equals 0.50mm. This gives us 0.50/5=100microns. That means that you will be fine with a standard Type 2 paste (see J-STD-004).

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