Reflow with Sn/Pb=90/10 with Golden Palting PCB

Dear,

I am looking for the supports, specification, etc of the solderiability of Hot bar Reflow process with:

A). FPC plating with sb/pb= 90/10, to be mounted to B) B). Golden plating PCB

Please kindly input,

As far as I know the melting point of the 90/10 is 183~213degrees C,

- Is this more suitable to solder with Golden plating PCB than 63/37 or pur Tin; - How strong of the solder joint in such combination, more stronger that 63/37 or pure tin,

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