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SMT COMPONENTS TESTING

SMT COMPONENTS TESTING

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Can anybody suggest that how we can chek quality for solderi... - Jan 07, 2006 by MSK

apply flux then dip the component into a solder pot. this wo... - Jan 09, 2006 by

You can find some good idea by reading IPC-J-STD-002B (or ... - Jan 09, 2006 by

Perhaps I read your question wrong, but I would be more incl... - Jan 09, 2006 by Steve Thomas

Thanks to all but my quistion is that with which instrument ... - Jan 11, 2006 by MSK

MSK As GS told you in an earlier posting, J-STD-002 and I... - Jan 11, 2006 by davef

We've got a Must II, and it works fine. The service in the U... - Jan 11, 2006 by Rob

MSK

#38884

SMT COMPONENTS TESTING | 7 January, 2006

Can anybody suggest that how we can chek quality for soldering of chip capacitor & chip resistor. we are getting prob. of dry solder in chip components.

All Replies should be highly appriciated.

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slaine

#38891

SMT COMPONENTS TESTING | 9 January, 2006

apply flux then dip the component into a solder pot. this would check the wettability of the component.

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#38911

SMT COMPONENTS TESTING | 9 January, 2006

You can find some good idea by reading IPC-J-STD-002B (or later review ) Solderability test and also the JEDEC Standard (free down load) JESD22-B102D solderability test.

A suggestion, first of all check how old are the chips (read data Code on Label applied on Reels)

Regards.........GS

This message was posted via the Electronics Forum @

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Steve Thomas

#38913

SMT COMPONENTS TESTING | 9 January, 2006

Perhaps I read your question wrong, but I would be more inclined to look for changes in your solder paste, your screen printing process, and your reflow profiles if you're suddenly having problems with more than one component.

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MSK

#38958

SMT COMPONENTS TESTING | 11 January, 2006

Thanks to all but my quistion is that with which instrument we can check the wetteblity & what are the critiria to chek them.

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davef

#38959

SMT COMPONENTS TESTING | 11 January, 2006

MSK

As GS told you in an earlier posting, J-STD-002 and IEC 68-2-69 describe methods and equipment for component solderability testing. Go get a copy of either one. The primary component solderability test methods are: * Dip and look method * Wetting balance test

The Dip and Look Method is widely used in process QA and reliability monitoring. It is: * Qualitative test process using judgment on whether a sample passes or fails the test. * Based on the physical and visual attributes that the sample exhibits.

Wetting balance analyzer suppliers are: * Multicore MUST II Wetting Balance Tester * Robotic Process Systems 6 Sigma Wetting Balance Tester

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Rob

#38967

SMT COMPONENTS TESTING | 11 January, 2006

We've got a Must II, and it works fine. The service in the UK is good too, but the upgrades (i.e. to lead free) are expensive, and last time we checked the new software wasn't 100% ready.

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