Micron Laser Technology
Rigid and Flex Circuit Board Laser Processing Services including SMT Stencils, Microvia Drilling, Selective Solder Mask Rework, PCB Rework, Laser Marking, Part Excising or Routing, Cavity / Window / Limited-Depth Skiving.
Micron Laser Technology Postings
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Pad Isolation and Trace Cutting Services
MLT provides laser rework services for PCB's including pad / component isolation and trace cutting. Contacts, pads, or other metal features can be laser defined or redimensioned without plunging into the dielectrics below. ...
Microvia Laser Drilling Services
MLT provides microvia laser drilling services for both rigid and flexible circuit board manufacturers. MLT is a leader in HDI drilling and design consulting to minimize drilling costs. All IPC high density microvia types are su...
MLT provides rigid and flexible circuit laser services including laser routing (excising), cavity skiving, coverlay/coverfilm routing, microvia drilling, ZIF Contours, Kapton window skives, depaneling, and marking. With 20 years expe...
MLT provides laser decapsulation, "decap", services for removing encapsulation or mold compounds for accessing wirebonds, die, leadframes, and substrates....
MLT provides laser services to remove unwanted squeeze-out from exposed metal pads, traces, and cavities. Squeeze-out can take the form of polyimide adhesives or prepreg resins. Whether a part of your standard manufacturing process...
MLT provides laser services for selective solder mask removal as a precise and controlled rework option. No more scrapping or tedius hours to rework selective areas to recover simply unwanted solder mask. This same process work...
MLT stainless steel and non-metal stencils (i.e. Kapton) are laser fabricated for applying solder paste, flux, solderballs, to circuit boards, wafers, and components for prototypes, volume production, and PCB rework....
