Welcome to K-NET INTERNATIONAL
K-Net is a distributor and representative of world-class companies and products. We supply material and tools for SMT, Chip On Board (COB), Semiconductors and Automotive. Customer satisfaction is our mission that we constantly improve.
Chip On Board
Chip-on-board, COB, is a technology where uncoated semiconductor elements (dice, die, chip) are mounted directly on a PCB or a substrate of e.g. glasf...
Surface Mount Technology
Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface o...
Semiconductor
A semiconductor is a material which has electrical conductivity between that of a conductor such as copper and that of an insulator such as glass. Sem...
Consumable Products
Consumable Products...
Printed Cirtcuit Board Assembly (PCBA)
A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features e...
SJB Capillary
Solder Jet Bonding (SJB) is now the standard technology to support HDD requirements
Beside the common HDD applications, the Solder Jet process is als
Fine Wire Wedge Bonding Tools
MPP Fine Wire Wedges range from fine pitch wedges to Ultra Fine Pitch Wedges (35 um pitch with a 20 um wire), as well as Deep Access Wedges, Chip On B
Heavy Wire Wedge Bonding Tools
Large wire is usually considered to range from about 75 or 100 um to over 500 um in diameter (3-20 mils).
The current large-wire technology includes
Clean Dice
1. Reducing bond pad corrosion phenomenon; increase the removal of silicon
particles.
2. Effectively improve wafer corrosion issues.
3. Improve side w
Laser Sawing Solution
Laser Sawing Solution is design specifically for the laser cutting process.
Perfectly suitable for laser cutting that improves the lubricity while imp
Electric Flame Off (EFO) / Torch Electrode
We can provide a full range of electronic flame off components (EFO's) incorporating Iridium or Platinum electrode materials.
