AIM Solder Products

SMT Products and Services offered by AIM Solder

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AIM Solder Products

AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry. »»

Headquarters: Montreal, Quebec, Canada

Manufacturer Manufacturer

44 listed by AIM Solder

Product	Category
High Melting Point Solder Alloys Down hole electronics, such as oil and gas exploration, require solder alloys that have the durability to withstand the extreme thermal, geological and mechanical stresses of these applications. AIM understands system reliability is of the utmost importance, and offers a selection of hi...	Solder Materials
SN100C - Lead-Free Solder Alloy Best choice for lead-free wave soldering. SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of...	Solder Materials
SAC305 Lead-Free Solder Alloy SAC305 is a lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared to other alloys and makes of bar, resultin...	Solder Materials
Sn63/Pb37 Electropure™ High Purity Solder Alloy Sn63/Pb37 Electropure™ is a high purity alloy that is composed of 63% tin and 37% lead. Electropure is alloyed in a proprietary method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solder, thus reducing drossing, impro...	Solder Materials
DJAW-10 Stencil Cleaner DJAW-10 is a long chained alcohol based stencil cleaner with a concentrated additive that is 100% compatible with all AIM solder pastes. DJAW-10 is formulated for application by hand or automated dispensing equipment. Unlike other stencil cleaners, AIM stencil cleaners help to reduce so...	Cleaning Agents
200AX Stencil Cleaner - Hand Application A solvent blend stencil cleaner with a concentrated additive that is 100% compatible with all AIM solder pastes and epoxies. 200AX is formulated for application by hand. Where automatic application is desired, AIM’s DJAW Stencil Cleaner is recommended. The AIM stencil c...	Cleaning Agents
AIMTERGE 6035 Solder Paste, Flux and Wire Residues Cleaner AIMTERGE 6035 cleaner is a saponifier formulated to readily remove resin, rosin, no clean and water soluble flux residues from printed circuit boards, while preventing the attack of components and aluminum hardware common with many saponifers. The removal of water-soluble organic acid flux residu...	Cleaning Agents
Common Flux Thinner Common Flux Thinner is a solvent that is used to thin Water Soluble, No Clean and RMA fluxes in foaming and some spray applications. Use of Common Flux Thinner is suggested when the flux acid number is too high due to solvent evaporation or residues increase due to evaporation. ...	Solder Materials
Underfill FF35 Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underfill FF35 offers superior reliability through hi...	Materials
Surface Mount Epoxy 4089 Epoxy 4089 is a single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. Epoxy 4089 has a formulated tolerance to shear-thinning, a dot formation suitable for automated dispense equipment or positive displacement pump systems, and ...	Dispensing
RMA Mildly Activated, General-Purpose Cored Solder Wire RMA is a mildly activated, general-purpose wire solder for use in applications requiring good activation. RMA cored wire is active enough for excellent tarnish or oxide removal, and will produce bright shiny solder joints. RMA wire will leave slight to moderate post-process residues that may be l...	Solder Materials
RA-301 Fully Activated, Rosin-Based Flux RA-301 is a fully activated rosin-based flux formulation containing 35% solids. RA-301 has a very wide process window, which makes it an acceptable alternative to a variety of environments and process applications. RA-301 has a high activity level that provides bright, shiny solder joints and is ...	Solder Materials
RMA202-25 Medium Solids, Mildly Activated Flux RMA 202-25 is a medium solids, mildly activated liquid flux with a solvent rosin activation formulated to provide a post-process flux residue that is both insulating and non-hydroscopic and does not require cleaning. As a mildly activated rosin based flux, RMA 202-25 offers a wide process window,...	Solder Materials
WS Water Washable Tacky/Rework Paste Flux AIM WS Paste Flux is a water washable tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM WS Paste Flux may be used for general touch up or rework of printed circuit boards, and for attaching spheres to ball grid array (BGA) ...	Solder Materials
OAJ Cored Wire OAJ Cored Wire features a halide-activated system that has been neutralized with an amine. The aminehydrohalide provides a high activation level that produces excellent tarnish or oxide removal, and maximum capillary action, leading to faster wetting, and reducing the chances of thermal degradati...	Solder Materials
WS730 High-Activity, Water Soluble Liquid Flux WS730 is a water-based, high activity liquid flux designed to offer low-spattering and excellent wetting, even to difficult-to-solder parts. WS730 is formulated for a variety of electronic, electrical and industrial applications, including wire, cable, and terminal lead tinning and soldering, fla...	Solder Materials
WS770 VOC-Free, Water-Soluble Liquid Flux WS770 is a PH neutral, organically activated, water-based, VOC-free water-soluble liquid flux formulated to fully atomize during the wave soldering process. WS770 may be applied by automated flux sprayers, foamed, dipped, or brushed on with favorable results. WS770 is a buffered flux th...	Solder Materials
WS715M Rosin-Free, Water Soluble Liquid Flux For Wave Solder Applications WS715M is a neutral alcohol based, organically activated, rosin-free, water soluble liquid flux designed specifically for wave solder applications. Though designed for application via foam fluxer, WS715M may also be applied by automated flux sprayers, dipped, or brushed on with favorable results....	Solder Materials
WS735 Water-Soluble Liquid Flux For Wave Solder Applications WS735 is an alcohol based, organically activated, water-soluble liquid flux designed specifically for wave solder applications. WS735 may be applied by automated flux sprayers, foamed, dipped, or brushed on with favorable results. WS735 is active at room temperature and maintains a wide activatio...	Solder Materials
NC265LR Low-Residue Liquid Spray Flux IPA-based, low-residue flux for spraying applications. Low-Residue Rosin- and Resin-Free Fast Wetting for SN100C & SAC Alloys Lead-Free & Tin-Lead Compatible Halide-Free Excellent Wetting Avail...	Solder Materials
NC265 Liquid Flux For Foaming or Spraying Applications IPA-based flux for foaming or spraying applications. Rosin/Resin Free Low Post-Process Residues Broad process window Fast wetting for SN100C & SAC alloys Lead-free & tin-lead compatible Halide-free Avail...	Solder Materials
NC520 Lead-Free & Tin-Lead Solder Paste For Use with Demanding High Density Electronic Assemblies. NC520 is a general no clean paste for use with lead-free and tin/lead alloys . NC520 has been developed to offer excellent wetting, improved printing and to reduce voiding. Reduced Head-in-Pillow ...	Solder Materials
NC No-Clean Tacky/Rework Solder Paste Flux NC Paste Flux is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM NC Paste Flux may be used for general touch up or rework of printed circuit boards, and for attaching spheres to ball grid array (BGA) packages.<...	Solder Materials
NC217 Lead-Free & Tin-Lead Gel Flux NC217 Gel Flux is designed for touch-up and repair work where the flux may spread away from the heat source. NC217 Gel Flux is electrically safe even without a thermal profile. This gel flux dries within one hour of use with or without heat and is tack-free after four hours. <...	Solder Materials
NC263UR Rosin/Resin Free Liquid Flux NC263UR is a rosin-free, resin-free, halide-free, no-clean wave solder flux designed to promote enhanced wetting during the wave soldering process. NC263UR has a higher activity level and lower surface tension than other no-clean liquid fluxes. NC263UR performs well with bare copper, solder-coate...	Solder Materials
NC277 Voc-Free Liquid Flux NC277 Liquid Flux is a water-based VOC-Free flux that has performance and reliability characteristics equal or superior to many alcohol-based fluxes. A medium-solids/residue flux, NC277 has an exceptionally durable and powerful activator system making it ideally suited for high thermal mass assem...	Solder Materials
NC275LR Low-Residue Voc-Free Liquid Flux NC275LR is a water-based, halide-free, no-clean liquid flux formulated to offer a very wide process window allowing for extremely good wetting, even to difficult-to-wet materials. NC275LR offers a broad activation range, proving to be an excellent flux for a variety of process parameters and appl...	Solder Materials
NC257MD Jet Printing Solder Paste for MyData MY500 Jet Printer. NC257MD solder paste has been specifically designed for the MyData MY500 Jet Printer. Its unique rheological properties were engineered and validated through extensive testing to provide continuous and consistent deposits. Clear Pin-Probe Testable Residue	Solder Materials
NC273LT Solder Paste For Bismuth Bearing Alloys AIM's NC273LT solder paste formula with bismuth containing alloys can provide an assembler with an innovative solution when temperature sensitivity is paramount. The revolutionary activator system in AIM's new NC273LT low temperature solder paste improves the wetting performan...	Solder Materials
NC254 Lead-Free & Tin/Lead Dispensing Solder Paste NC254 is a lead-free and tin-lead compatible solder paste that offers very good wetting, clear residues and has shown to eliminate voiding under micro-BGAs. NC254 has been developed to offer extremely broad process windows for printing, wetting and pin probe testing. The superio...	Solder Materials
M8 No Clean, Halogen-Free Solder Paste AIM introduces M8 Solder Paste, a high reliability no clean paste for use with SAC305 and Sn/Pb alloys. M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 platform, M8 brings no clean solder paste...	Solder Materials
NC259 Lead-Free, Halogen-Free Solder Paste AIM is pleased to offer NC259 Solder Paste designed specifically for use with SN100C® and other no- and low-silver alloys. NC259 is a low-cost, lead-free halogen-free solder paste that offers the performance of tin-lead and high-silver lead-free solder pastes. Now manufa...	Solder Materials
RA (Rosin Activated) Cored Wire Rosin Activated Cored Wire Solder RA is a fully activated, general-purpose wire solder for use in applications where mildly activated fluxes are too weak. RA cored wire is strong enough for excellent tarnish and oxide removal, and will produce bright shiny solder joints. RA wire w...	Solder Materials
NC280 Low-Residue Liquid Rework Flux NC280 is a low-to-medium solids, no-clean liquid flux formulated to leave minimal post-process residues that are pin testable without cleaning. NC280 offers an excellent activity level with good performance on bare copper, solder coated and organic coated PWBs, leaving negligible post-proce...	Solder Materials
Surface Mount Epoxy 4044 Epoxy 4044 is a single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. Epoxy 4044 has a formulated tolerance to shear-thinning, a dot formation suitable for automated dispense equipment or positive displacement pump systems, a...	Dispensing
GLOW CORE Cored Wire - No-Clean Flux Solder Wire Glow Core is a no-clean, halide-free, resin-based flux cored wire solder designed to offer excellent wetting characteristics and lead-free compatibility. This product is very active and is recommended for fast cycle time soldering. Glow Core flux promotes good thermal transfer, offering better...	Solder Materials
WS488 Water Soluble Solder Paste AIM’s WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 offers superior slump resistance, as well as excellent print characteristics and 8+ hours of stencil life. WS488 is compatible with ...	Solder Materials
One-Step Underfill 688 A non-odorous, low surface tension, one component epoxy resin designed as a one-step underfill for flip chip, CSP, BGA and uBGA assemblies. One-Step Underfill 688 is a low surface tension, one component epoxy resin designed as a one-step no-flow underfill for flip chip, CSP, BGA and m...	Materials
NC275LR Low-Residue Liquid Flux NC275LR is a water-based, halide-free, no-clean liquid flux formulated to offer a very wide process window allowing for extremely good wetting, even to difficult-to-wet materials. NC275LR offers a broad activation range, proving to be an excellent flux for a variety of process parameters and a...	Solder Materials
RMA258-15R Rosin Based Solder Paste RMA258-15R is a rosin based solder paste that has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. RMA258-15R reduces such defects as voiding and eliminates head-in-pillow. The superior wetting ability of RMA258-15R r...	Solder Materials
WS482 - Water Soluble, Halide-free Flux Cored Wire WS482 is a water soluble, halide-free flux cored wire that is highly active and compatible with water soluble solder paste chemistries. WS482 offers improved thermal stability, allowing it to be processed with standard or high temperature alloys. WS482 offers residu...	Solder Materials
NC264-5 No Clean Liquid Flux An alcohol based, halide free, no-clean liquid flux designed specifically to have a very wide process window for wave solder applications. Recommended for tin-lead and lead-free wave soldering applications. Especially suitable for foaming applications. Features:	Solder Materials
WS716 Water Soluble Liquid Flux for Wave Solder Applications WS-716 is a halide-free, alcohol based, organically activated, rosin-free, water soluble liquid flux designed specifically for wave solder applications. WS716 is the liquid version of the WS-477S1 series solder paste. Though designed for application via foam fluxer, WS716 may also be ...	Solder Materials
NC258 Lead-Free & Tin-Lead Solder Paste Solving the Most Challenging Lead-Free Application Problems AIM's newest product, its NC258 No-Clean Solder Paste, offers one of the longest pause-to-print windows in the industry and also enhances fine print definitions. Further improving the soldering process, are the NC258&...	Solder Materials

Product

High Melting Point Solder Alloys

Down hole electronics, such as oil and gas exploration, require solder alloys that have the durability to withstand the extreme thermal, geological and mechanical stresses of these applications. AIM understands system reliability is of the utmost importance, and offers a selection of hi...