Indium Corporation Products

SMT Products and Services offered by Indium Corporation


Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more. »»

Headquarters: Utica, New York, USA

Manufacturer Manufacturer

Indium Corporation website
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10 listed by Indium Corporation

Product

Category

Durafuse™ LT - Low Temperature Solder Paste

Durafuse™ LT is a novel, low-temperature alloy system designed to provide high-reliability in low applications that are looking for a reflow temperature below 210°C. Where traditional low-temperature solders often produce brittle solder joints that are susceptible...

Durafuse™ LT - Low Temperature Solder Paste

Solder Materials

Indium6.4R Water-Soluble Pb-Free Solder Paste

Indium6.4R is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It excels in both SnPb and Pb-free assembly processes, providing an exceptional reflow process window. This solder paste delivers outstanding stencil printing performance, with long stencil life and...

Indium6.4R Water-Soluble Pb-Free Solder Paste

Solder Materials

NanoFoil® Multi-Layer Bonding Material

NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for a variety of applications...

NanoFoil® Multi-Layer Bonding Material

Materials

Indium8.9 Pb-Free Solder Paste

Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace c...

Indium8.9 Pb-Free Solder Paste

Solder Materials

SACM™ Soldering Alloy

Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to ...

SACM™ Soldering Alloy

Solder Materials

Solder Spheres

New Precision BGA Spheres Optimize Sphere Performance Indium Corporation’s Solder Spheres for PBGA, CBGA, TBGA, µBGA¬ and Flip Chip applications are made by a proprietary manufacturing process that consistently results in high sphericity and accurate diameters....

Solder Spheres

Solder Materials

Indium Solder Wire

Solder Wire from the Indium Corporation is made to demanding quality standards. Our flexible manufacturing process allows us to fulfill orders from evaluation/research quantities to full scale production volumes. Indium Solder Wire Diameters We make a wid...

Indium Solder Wire

Solder Materials

Indium Solder Pastes

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for your application. Specialized ...

Indium Solder Pastes

Solder Materials

Solder Preforms

Preforms come in standard shapes such as squares, rectangles, washers and discs. Typical sizes range from .010" (.254mm) up to 2" (50.8mm). Smaller and larger sizes, as well as custom shapes, are also available. Dimensions can be held to tight tolerances to assure volume accuracy.

Solder Preforms

Solder Materials

Flux and Epoxy Products

Indium Corporation is a developer, manufacturer, and global supplier of: specialty solders (including solder paste, preforms, spheres, columns, wire, tubing, ribbon, and foil), fluxes, electrically-conductive adhesives, inorganic compounds (including indium oxide, indium-tin oxide, indium hydr...

Flux and Epoxy Products

Solder Materials

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Please contact the website administrator.


The following information is meant for the website developer for debugging purposes.
Error Occurred While Processing Request

Error Executing Database Query.

Could not create connection to database server. Attempted reconnect 3 times. Giving up.
 
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59 : 	<cfset request.adlist="">
60 : 	<!--- building targeted ad list --->
61 : 	<cfquery datasource="#attributes.datasource#" name="Qget_target" cachedWithin="#createTimeSpan( 0, 0, 10, 0 )#">
62 : 		select distinct ac.company_id,ck.keyword,adid,cm.name
63 : 		from adclients ac

SQLSTATE   08001
DATASOURCE   admanager_mysql
SQL    select distinct ac.company_id,ck.keyword,adid,cm.name from adclients ac join adsystem asys on ac.login=asys.login join site_dbo.company_keyword ck on ac.company_id=ck.company_id join site_dbo.company_main cm on ac.company_id=cm.id where targeted=1 and active=1 and keyword<>''
Resources:

Browser   claudebot
Remote Address   54.152.43.79
Referrer  
Date/Time   29-Mar-24 09:29 AM
Stack Trace
at cfadsystem_mod2ecfm1546098271._factor0(/var/www/smtnet/adsystem/adsystem_mod.cfm:61) at cfadsystem_mod2ecfm1546098271._factor16(/var/www/smtnet/adsystem/adsystem_mod.cfm:58) at cfadsystem_mod2ecfm1546098271.runPage(/var/www/smtnet/adsystem/adsystem_mod.cfm:1) at cfdsp_global_layout2ecfm1131192918._factor1(/var/www/smtnet/dsp_global_layout.cfm:422) at cfdsp_global_layout2ecfm1131192918._factor27(/var/www/smtnet/dsp_global_layout.cfm:389) at cfdsp_global_layout2ecfm1131192918.runPage(/var/www/smtnet/dsp_global_layout.cfm:1) at cfdsp_layout2ecfm507669117.runPage(/var/www/smtnet/company/dsp_layout.cfm:1) at cfindex2ecfm100786478._factor30(/var/www/smtnet/company/index.cfm:363) at cfindex2ecfm100786478._factor36(/var/www/smtnet/company/index.cfm:339) at cfindex2ecfm100786478._factor37(/var/www/smtnet/company/index.cfm:11) at cfindex2ecfm100786478.runPage(/var/www/smtnet/company/index.cfm:1)

com.mysql.jdbc.exceptions.jdbc4.MySQLNonTransientConnectionException: Could not create connection to database server. Attempted reconnect 3 times. Giving up.
	at sun.reflect.GeneratedConstructorAccessor917.newInstance(Unknown Source)
	at sun.reflect.DelegatingConstructorAccessorImpl.newInstance(DelegatingConstructorAccessorImpl.java:45)
	at java.lang.reflect.Constructor.newInstance(Constructor.java:423)
	at com.mysql.jdbc.Util.handleNewInstance(Util.java:395)
	at com.mysql.jdbc.Util.getInstance(Util.java:370)
	at com.mysql.jdbc.SQLError.createSQLException(SQLError.java:999)
	at com.mysql.jdbc.SQLError.createSQLException(SQLError.java:973)
	at com.mysql.jdbc.SQLError.createSQLException(SQLError.java:959)
	at com.mysql.jdbc.SQLError.createSQLException(SQLError.java:904)
	at com.mysql.jdbc.ConnectionImpl.connectWithRetries(ConnectionImpl.java:2369)
	at com.mysql.jdbc.ConnectionImpl.createNewIO(ConnectionImpl.java:2290)
	at com.mysql.jdbc.ConnectionImpl.<init>(ConnectionImpl.java:818)
	at com.mysql.jdbc.JDBC4Connection.<init>(JDBC4Connection.java:31)
	at sun.reflect.GeneratedConstructorAccessor85.newInstance(Unknown Source)
	at sun.reflect.DelegatingConstructorAccessorImpl.newInstance(DelegatingConstructorAccessorImpl.java:45)
	at java.lang.reflect.Constructor.newInstance(Constructor.java:423)
	at com.mysql.jdbc.Util.handleNewInstance(Util.java:395)
	at com.mysql.jdbc.ConnectionImpl.getInstance(ConnectionImpl.java:400)
	at com.mysql.jdbc.NonRegisteringDriver.$fr$connect(NonRegisteringDriver.java:346)
	at com.mysql.jdbc.NonRegisteringDriver.connect(NonRegisteringDriver.java)
	at coldfusion.server.j2ee.sql.pool.JDBCPool.createPhysicalConnection(JDBCPool.java:614)
	at coldfusion.server.j2ee.sql.pool.ConnectionRunner$RunnableConnection.run(ConnectionRunner.java:67)
	at java.lang.Thread.run(Thread.java:748)
Caused by: com.mysql.jdbc.exceptions.jdbc4.MySQLNonTransientConnectionException: Data source rejected establishment of connection,  message from server: "Too many connections"
	at sun.reflect.GeneratedConstructorAccessor917.newInstance(Unknown Source)
	at sun.reflect.DelegatingConstructorAccessorImpl.newInstance(DelegatingConstructorAccessorImpl.java:45)
	at java.lang.reflect.Constructor.newInstance(Constructor.java:423)
	at com.mysql.jdbc.Util.handleNewInstance(Util.java:395)
	at com.mysql.jdbc.Util.getInstance(Util.java:370)
	at com.mysql.jdbc.SQLError.createSQLException(SQLError.java:999)
	at com.mysql.jdbc.SQLError.createSQLException(SQLError.java:973)
	at com.mysql.jdbc.SQLError.createSQLException(SQLError.java:959)
	at com.mysql.jdbc.MysqlIO.doHandshake(MysqlIO.java:1112)
	at com.mysql.jdbc.ConnectionImpl.coreConnect(ConnectionImpl.java:2467)
	at com.mysql.jdbc.ConnectionImpl.connectWithRetries(ConnectionImpl.java:2308)
	... 13 more