S-Bond Technologies Products

SMT Products and Services offered by S-Bond Technologies

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S-Bond Technologies Products

S-Bond Technologies

Brazing and soldering, metal bonding, dissimilar materials, active solder technology »»

Headquarters: Lansdale, Pennsylvania, USA

Manufacturer

6 listed by S-Bond Technologies

Product	Category
EWI SonicSolder S-Bond has been licensed as a supplier and provider of ultrasonic activated joining services using EWI SonicSolder®, an EWI patented* binary lead-free solder alloy that melts at 231°C. In conjunction with ultrasonic soldering, it can be used to join difficult-to-wet materials like aluminum, titanium...	Assembly Services
Soldering Assembly Services S-Bond Technologies offers both conventional flux soldering and S-Bond soldering. As an Active Solder, S-Bond solder is flux-free eliminating the potential of contamination and corrosion associated with fluxes. Additionally, S-Bond’s limited capillary action is beneficial in that it “stays where you...	Assembly Services
Direct Die Attachment Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces. SBT offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallization or flux which, in many cases, can withstand le...	Assembly Services
Advanced Thermal Management S-Bond® solders are unique in their ability to provide a high performance thermal joint between these materials. S-Bond materials offer approximately 10 times the thermal conductivity of most thermal epoxies along with the ability to bond in air without the use of fluxes. They also allow for the rew...	Assembly Services
Sensor Bonding S-Bond joins metals, ceramics, carbon, carbides, and semiconductors making S-Bond a viable process assemble and bond sensors and sensor housings. Applications include the fluxless joining of electrical signal leads to sensor elements where twisted leads can be bonded to graphite or even active ceram...	Materials
Aluminum Bonding Alternative to Brazing S-Bond can be an alternative lower temperature joining process and replace brazing in some applications. S-Bond is very effective in soldering aluminum to aluminum as well as soldering aluminum to copper. ...	Materials

Product

EWI SonicSolder

S-Bond has been licensed as a supplier and provider of ultrasonic activated joining services using EWI SonicSolder®, an EWI patented* binary lead-free solder alloy that melts at 231°C. In conjunction with ultrasonic soldering, it can be used to join difficult-to-wet materials like aluminum, titanium...

Assembly Services

Soldering Assembly Services

S-Bond Technologies offers both conventional flux soldering and S-Bond soldering. As an Active Solder, S-Bond solder is flux-free eliminating the potential of contamination and corrosion associated with fluxes. Additionally, S-Bond’s limited capillary action is beneficial in that it “stays where you...

Assembly Services

Direct Die Attachment

Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces. SBT offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallization or flux which, in many cases, can withstand le...

Assembly Services

Advanced Thermal Management

S-Bond® solders are unique in their ability to provide a high performance thermal joint between these materials. S-Bond materials offer approximately 10 times the thermal conductivity of most thermal epoxies along with the ability to bond in air without the use of fluxes. They also allow for the rew...

Assembly Services

Sensor Bonding

S-Bond joins metals, ceramics, carbon, carbides, and semiconductors making S-Bond a viable process assemble and bond sensors and sensor housings. Applications include the fluxless joining of electrical signal leads to sensor elements where twisted leads can be bonded to graphite or even active ceram...

Materials

Aluminum Bonding

Alternative to Brazing S-Bond can be an alternative lower temperature joining process and replace brazing in some applications. S-Bond is very effective in soldering aluminum to aluminum as well as soldering aluminum to copper. ...

Materials