YINCAE Advanced Materials, LLC. Products

SMT Products and Services offered by YINCAE Advanced Materials, LLC.

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YINCAE Advanced Materials, LLC.
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YINCAE Advanced Materials, LLC. Products

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials. »»

Headquarters: Albany, New York, USA

Manufacturer Manufacturer

26 listed by YINCAE Advanced Materials, LLC.

Product	Category
Low Temperature Reflowable Underfill Material: SMT 160L (Albany, NY) 1/3/2018 – YINCAE Advanced Materials has recently developed a low temperature curable reflowable (no flow) underfill: SMT 160L. This product is designed to eliminate capillary underfills, simplify the assembly process, combine soldering and und...	Materials
DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials (Albany, NY) December 22, 2017 – The DA 150 series materials are YINCAE’s new fast curing die attach adhesives. The DA 150 series offers conductive and insulating options to suit a large variety of applications. These products can be cured quickly at 150°C and off...	Materials
YINCAE’S New Reflowable Underfill Material: SMT 160 (Albany, NY) 1/2/2018 – YINCAE Advanced Materials has recently developed a reflowable (no flow) underfill: SMT 160. This product is designed to eliminate capillary underfills, simplify the assembly process, combine soldering and underfilling in SMT processe...	Materials
High Purity Liquid Encapsulant: SMT 158HA YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA (Albany, NY) 10/20/2017 – YINCAE Advanced Materials has recently developed a unique amine based high purity liquid epoxy encapsulant: SMT 158HA. SMT 158HA is a slow cure underfill particularly desi...	Materials
SMT 88UL Super-Fast Flow Room Temperature Underfill SMT 88UL is a super-fast flow capillary underfill, which can flow into 10μ gap at room temperature without preheating a substrate. After cure, there is void free in underfill. The cured SMT 88UL can be easily reworked. SMT 88UL not only can be used as a underfill for chip scal...	Materials
SMT 158UL Room Temperature Underfill SMT 158UL is a super-fast flow capillary underfill, which can flow into 10μm gap at room temperature without preheating a substrate. After cure there is void free in underfill. The cured SMT 158UL can be easily reworked. SMT 158UL not only can be used as a underfill for chip scale package, bal...	Materials
BP 256 Ball Attach Adhesive BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During the reflow process, this polymer adhesive remov...	Materials
SMT 158D High Thermal Conductive Underfill SMT 158D high thermal conductive underfill is a capillary flow underfill, low temperature cure, fast flowing, easy reworking liquid epoxy which can be used as a underfill for flip chip, chip scale package, ball grid array devices, package on package and land grid array application. It is also sui...	Materials
SMT 256EP Solder Joint Encapsulant Paste SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and thermal conductivity, outstanding reliability, ...	Materials
SMT 266 Solder Joint Encapsulant SMT266 offers all the features and advantages of our SMT256 series, in a convenient jetting adhesive form (and can also be brushed on during rework). SMT 266 series spray adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, ...	Materials
SMT 256B Solder Joint Encapsulant SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer adhesive and SMT 256B can encapsulate bumps of a com...	Materials
WL 66O Optical Lens Adhesive WL 66O is one part 100% solid, dual cure UV bonding adhesives, which has been designed for wafer-level lens or optical lens attachment. It can be cured by UV in a few seconds to achieve fast fixing purpose, then further cured by thermal cure to achieve the high reliability. WL 66O not only provid...	Materials
TM 150 Solderable Conductive Adhesive TM 150 series solderable conductive adhesives is rapid cure, self-filling, self-leveling and self-soldering adhesives which can be used as die attach adhesives for LED, CSP, QFP, and so on, to replace conductive adhesives (Ag) or solder materials such as solder paste or preform. By comparison wit...	Materials
LEN 66A Optical Bonding Adhesive LEN 66A is one part 100% solid, super fast UV curable bonding adhesives, which has been designed for lens attachment, protective cover windows and touch screens. It can also be used for LCD lamination and sealing, polarizer lamination and touch screen bonding and so on. After cure, LEN 66A not on...	Materials
ACP 120 Anti-Oxidation Solderable Coating ACP 120 series are an anti-oxidation solderable coatings, which have been designed for anti-corrosion and rusting for metal surfaces such as nickel, steel, aluminum and other metals; solderable surfaces on which solder paste, solder preform or solder ball can be soldered. ACP 120 can be applied u...	Materials
DA 90 Die Attach Adhesive DA 90 is a silver filled, high thermal conductive, solvent-free and fast curing thermosetting die attach adhesives. DA 90 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. It can be applied using dispense or printing method. It has demonstrated h...	Materials
SMT 88U Underfill Series World's First Super Fast Low Temperature Underfill. SMT88U is an adhesive, which combines the advantages of fast cure in UV adhesives, and the better reliability of capillary underfill. It can be underfilled at room temperature without preheating a substrate. Advantages include vo...	Materials
SMT 158 Capillary Underfill Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP (package-on-package) and land grid arrays as well...	Materials
DA 150 Die Attach Adhesive Our DA150 series are solvent-free and fast cure thermosetting electrical and thermal conductive die attach adhesives. DA150 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. Both dispense and printing methods can be used. It has demonstrated high...	Materials
SMT 256 Solder Joint Encapsulant World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulation adhesive. Th...	Materials
TGP 110 Thermal Conductive Adhesives Our TGP110 thermal conductive adhesives is a series of reactive thermal grease with very thin BLT that eliminates micro-bubbles at the rough interface when applied. In service time, it can be cured to form thermal gel or thermal pad but with the performance of thermal phase change. TGP1...	Materials
TM 230 Solderable Conductive Adhesives TM230 solderable conductive adhesives are rapid cure, self-filling, self-leveling and self-soldering adhesives which can be used as die attach adhesives for LED, CSP, QFP, among others, to replace conductive adhesives (Ag) or solder materials such as solder paste or preform. In comparison to cond...	Materials
NC 256 YINCAE is excited to announce that we have successfully developed a new No Clean Flux product - NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, F...	Solder Materials
SMT 256EP Encapsulant Paste	Materials
SMT 256EP Series	Solder Materials
SMT 158R Application Process Filled Fluxing Underfill Product...	Materials

Product

Low Temperature Reflowable Underfill Material: SMT 160L

(Albany, NY) 1/3/2018 – YINCAE Advanced Materials has recently developed a low temperature curable reflowable (no flow) underfill: SMT 160L. This product is designed to eliminate capillary underfills, simplify the assembly process, combine soldering and und...