Headpcb Products

SMT Products and Services offered by Headpcb


Headpcb

Head Electronics Co., Limited (Headpcb), established in 2001, is one of leading quick turn PCB manufacturer who specializes in L2~L30 high-mix, low volume and quickturn prototype PCB for high-tech industries in 30 countries. »»

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27 listed by Headpcb

Product

Category

HIGH HEAT DISSIPATION MCPCB

Project Description | Parameters 1 Layer  Thickness: 1.2+/-0.1 mm Min Hole Size: 3.175 mm Width/Space: 0.12mm/0.1 mm Surface Treatment: OSP<...

HIGH HEAT DISSIPATION MCPCB

Through-Hole

ALUMINUM CLAD PCB

Project Description | Parameters 2 Layer  Thickness: 1.6+/-0.1 mm Min Hole Size: 0.65 mm Width/Space: 0.1mm/0.08 mm Surface Treatment: OSP

ALUMINUM CLAD PCB

Design Services

20 Layer Rigid-Flex Board

Project Description  | Parameters 4 Layer (1R+2F+1R) Thickness: 0.56+/-0.1 mm Min Hole Size: 0.3 mm Width/Space: 0.15mm/0.12 mm Surface Treatme...

20 Layer Rigid-Flex Board

Assembly Services

Single Side FPC with Stiffener

Project Description | Parameters 4 Layer  Thickness: 0.3+/-0.05 mm Min Hole Size: 0.2 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: ENIG<...

Single Side FPC with Stiffener

Wave Soldering

Flexible PCB connector

Project Description | Parameters 4 Layer (1R+2F+1R) Thickness: 0.56+/-0.1 mm Min Hole Size: 0.3 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: EN...

Flexible PCB connector

Cable & Wire Harness Equipment

Countersink PCB

Project Description | Parameters 4 Layer Thickness: 1.6+/-0.16 mm Min Hole Size: 0.4 mm Width/Space: 0.25mm/0.2 mm Surface Treatment: ENIG

Countersink PCB

Assembly Services

12 Layer Back Drill PCB

Project Description | Parameters 12 Layer  Thickness: 2.4+/-0.24 mm Min Hole Size: 0.25 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: ENIG&...

12 Layer Back Drill PCB

Through-Hole

Castellated Holes PCB

Project Description | Parameters 4 Layer Thickness: 1.8+/-0.18 mm(High Tg S1000-2 Material) Min Hole Size: 0.2 mm Width/Space: 0.15mm/0.12 mm Surfac...

Castellated Holes PCB

Fabrication Services

4 Layer OSP+ENIG PCB

Project Description | Parameters 4 Layer  Thickness: 1.2+/-0.12 mm Min Hole Size: 0.3 mm Width/Space: 0.12mm/0.12 mm Surface Treatment: ENIG<...

4 Layer OSP+ENIG PCB

Prototyping

Flexible PCB Cable

Project Description | Parameters 4 Layer  Thickness: 0.25+/-0.1 mm Min Hole Size: 0.3 mm Width/Space: 0.2mm/0.15 mm Surface Treatment: Flash Go...

Flexible PCB Cable

Fabrication Services

10 Layer 2 Stage BVH Board

Project Description | Parameters 10 Layer (2 Stage) Thickness: 2.0+/-0.2 mm Min Hole Size: Via: 0.2 mm                 &...

10 Layer 2 Stage BVH Board

Prototyping

High Thermal Conductivity Heavy Copper Board

Project Description  | Parameters 16 Layer  Thickness: 3.8+/-0.03 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: ENIG <...

High Thermal Conductivity Heavy Copper Board

Prototyping

Ceramic Base Board

Project Description  | Parameters 2 Layer Thickness: 0.63+/-0.06 mm Min Hole Size: 0.4 mm Width/Space: 0.16mm/0.13 mm Surface Treatment: ENIG&l...

Ceramic Base Board

Prototyping

3 Stage Stack Via HDI Board

Project Description | Parameters 10 Layer (3 Stage) Thickness: 1.6+/-0.16 mm Min Hole Size: Via: 0.25 mm                ...

3 Stage Stack Via HDI Board

Prototyping

Golden Finger PCB

Project Description | Parameters 10 Layer  Thickness: 1.6+/-0.16 mm Min Hole Size: 0.15 mm Width/Space: 0.12mm/0.1 mm Surface Treatment: ENIG+G...

Golden Finger PCB

Fabrication Services

Immersion silver PCB

Project Description | Parameters 2 Layer Thickness: 0.6+/-0.1 mm Min Hole Size: 0.5 mm Width/Space: 0.3mm/0.3 mm Surface Treatment: Immersion Silver...

Immersion silver PCB

Prototyping

6 layer heavy ENIG board

Project Description | Parameters 6 Layer  Thickness: 1.8+/-0.18 mm Min Hole Size: 0.25 mm Width/Space: 0.2mm/0.2 mm Surface Treatment: ENIG<...

6 layer heavy ENIG board

Prototyping

1 Layer Alu. PCB

Layer: 1L Material: Aluminum Board thickness: 1.6mm Surface technique: ImmersionGold Minimum hole size: 0.6mm Application field: LED, Automobile ...

1 Layer Alu. PCB

Components

4 Layer Rigid-flex PCB

Layers count: 4, Flex layers count: 2, Surface treatment: Immersion gold, Minimum hole size: 0.35mm, Minimum line width/space: 8/5.9 miles, Thickness: Rigid board: 2.00mm, Flex board: 0.24mm Size: 397.89 x 555mm ...

4 Layer Rigid-flex PCB

Components

2 Layer FPC

Layer: 2 layer Materials: PI Copper Thickness: 35um Min Board Thickness: 0.1mm Surface coating: HAL, HAL LF, Immersion Gold, Immersion Tin, Immersion Silver PI thickness: 1/2mil, 1 to 10 mil ADH thickness: 1/2mil, 1mil FPC, flexible PCB O...

2 Layer FPC

Components

1 Layer CEM-1 CTI600 PCB

Layer: 1L Base Material:CEM-1 CTI600 Board Thickness: 1.6mm Final copper: 35um Surface Finish: HAL lead free Solder mask: Matt Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture ...

1 Layer CEM-1 CTI600 PCB

Components

2 Layer CEM-3 pcb

Layer: 2L Base Material:CEM-3 CTI300 Board Thickness: 1.6mm Final copper: 35um Surface Finish: Immersion Tin/Sn Solder mask: Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture ...

2 Layer CEM-3 pcb

Components

8 Layer Mobile PCB

Specification: 8L(1+6+1) Material: FR-4 Board thickness: 1.0mm Final copper: 18um Solder mask color: Green Silkscreen: White Surface Finish: Immersion Gold Profile: Routing and stamp holes E-test: 100% Fixt...

8 Layer Mobile PCB

Components

6 Layer I/G, Impedance PCB

Specification: 6L Material: FR-4 TG170 Board thickness: 1.6mm Final copper: 35um Solder mask color: Blue Surface Finish: Immersion Gold, Au:3u” min. Impedance control Profile: Routing E-test: 100% Fixture <...

6 Layer I/G, Impedance PCB

Components

10 Layer Gold fingers PCB

Layer: 10L Base Material:FR-4 tg180(ITEQ) Board Thickness: 1.6mm Final copper: 35um Surface Finish:Immersion Gold/Au:2u” min. Gold fingers/Au:30u” Solder mask: Green Profile: Routing E-test: 100% Fixture Quality report...

10 Layer Gold fingers PCB

Components

8 layer inmmersion gold board

8 layers board Basic Material: FR-4 Board Ply (thickness): 1.80mm Measurement: 254mm x 304.8mm Conductor Width: 5mil (0.13mm) Conductor Spacing: 5mil (0.13mm) Surface Treatment: Immersion gold File Format: Gerber File (RS274X) Thr...

8 layer inmmersion gold board

Components

Back Plane Board

Project Description | Parameters 32 Layer  Thickness: 6.2+/-0.62 mm Size: 870*540mm Min Hole Size: Via: 0.65 mm  Width/Space: 0.1mm/0.15 m...

Back Plane Board

Prototyping

Jade Series Selective Soldering Machines

Electronics Equipment Consignment