Vimic Electronic Corporation Products

SMT Products and Services offered by Vimic Electronic Corporation


Vimic Electronic Corporation

Vimic is expert in the design and manufacture of various types of fluid dispensing tools and a selection of Die Bonding Tools for customized applications. The offering includes Epoxy Stamping Tools, Pick-up Tools, Push up Needles. »»

Headquarters: Taichung City, Taiwan

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Vimic Electronic Corporation website
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28 listed by Vimic Electronic Corporation

Product

Category

NH05 Writing Pen/ Dispensing Nozzle Tip

Dispensing nozzle tip also known as writing pen is used to dispense the glue to the die location with the compressed air in most of dispensing process, such as die bonding, electrical circuit connection, structural and circuit board connection. To ensure the glue flows s...

NH05 Writing Pen/ Dispensing Nozzle Tip

Dispensing

NH01 Dispensing Nozzle Tip

Dispensing tools can be defined as transfer of fluid from a container (usually a syringe) to substrate, one of the best options in meeting the requirement for adhesives in a wide array of packaging assemblies. In order to keep up with the rapid development of manufacturi...

NH01 Dispensing Nozzle Tip

Dispensing

NH11-T Common Dispensing Nozzle Tip

Common dispensing nozzle tip is used to dispense the glue to the die location with the compressed air in most of dispensing process, such as die bonding, electrical circuit connection, structural and circuit board connection. To ensure the glue flows smoothly, our dispen...

NH11-T Common Dispensing Nozzle Tip

Dispensing

NH03 Precision Nozzle

Precision nozzle can be defined as transfer of fluid from a container (usually a syringe) to substrate, one of the best options in meeting the requirement for adhesives in a wide array of packaging assemblies. To ensure the glue flows smoothly, our dispensing nozzles dea...

NH03 Precision Nozzle

Dispensing

NH38 High Precision Nozzle (Ceramic Dispensing Nozzle)

High precision dispensing nozzle is used to dispense the glue to the die location with the compressed air in most of dispensing process, such as die bonding, electrical circuit connection, structural and circuit board connection. To ensure the glue flows smoothly, our di...

NH38 High Precision Nozzle (Ceramic Dispensing Nozzle)

Dispensing

VASM-C-Ceramic Pick-up Tool

Vimic offer Die Collets and Pick-up Tools, manufactured from metallic (nickel alloy, tungsten carbide) and non-metallic (ceramic and high-temp plastic) materials to suit almost any application in bonding process. The decision whether to use a Die Collet or a Pick-up Tool...

VASM-C-Ceramic Pick-up Tool

Pick & Place

VASM-RU Vespel Pick-up Tool

Vimic offer Die Collets and Pick-up Tools, manufactured from metallic (nickel alloy, tungsten carbide) and non-metallic (ceramic and high-temp plastic) materials to suit almost any application in bonding process. We can design and manufacture the tips for die attach of t...

VASM-RU Vespel Pick-up Tool

Pick & Place

CL16-DIE COLLET

We can design and manufacture the tips for die attach of transistor, LED and other small die applications based on customer's demands. Die Collets common tip style& feature; Conical Tip Recta...

CL16-DIE COLLET

Pick & Place

SP02-C Single Pin Ceramic Stamping Tool

Stamping tools are also called as transfer or printing tools, the tools pick up adhesive paste from a tray and stamps the adhesive paste down on to the target pad. Adhesive stamping tools come in various design such as single dot, star, cross a...

SP02-C Single Pin Ceramic Stamping Tool

IC Packaging

SP02-TU2 Double Pin Epoxy Stamping Tool

Epoxy stamping tools come in various design such as single dot, star, cross and multi-tip and widely used in LED industry because of its simplicity and low cost. We manufacture hard material- tungsten carbide and ceramic materials to fit individual customer's demand in desi...

SP02-TU2 Double Pin Epoxy Stamping Tool

IC Packaging

SP02-TU9 Epoxy Stamping Tool (Multi-pin/ Grid)

Epoxy stamping tools come in various design such as single dot, star, cross and multi-tip and widely used in LED industry because of its simplicity and low cost. We manufacture hard material- tungsten carbide and ceramic materials to fit individual customer's demand in desi...

SP02-TU9 Epoxy Stamping Tool (Multi-pin/ Grid)

IC Packaging

VPN-TU4-CROWN PUSH UP NEEDLE/ EJECTOR PIN

Die Push-up Needles also named Ejector pins are mostly used in die bonding and die sorting process.  The needle tip pushes up the die through the expanding adhesive film after dicing for pick up by a collet. Depending on the die size, single pin or more pins (cr...

VPN-TU4-CROWN PUSH UP NEEDLE/ EJECTOR PIN

IC Packaging

NH01-RB Liquid Crystal Dispense Nozzle

Liquid Crystal Dispensing Nozzle is used to dispense the liquid crystal in LCD dispensing process. To ensure the liquid crystal flows smoothly, our dispensing nozzles dealt with a high precision processing method have features of integrated design and mirror grade inner ...

NH01-RB Liquid Crystal Dispense Nozzle

Dispensing

NH09 Fluid Dispensing Nozzle

Fluid dispensing nozzle can be defined as transfer of fluid from a container (usually a syringe) to substrate, one of the best options in meeting the requirement for adhesives in a wide array of packaging assemblies. To ensure the glue flows smoothly, our dispensing nozzles dealt with a h...

NH09 Fluid Dispensing Nozzle

Dispensing

VASM-T/ VASM-TU Pick-up Tool (Bottle Neck Design)

Vimic offer Die Collets and Pick-up Tools, manufactured from metallic (nickel alloy, tungsten carbide) and non-metallic (ceramic and high-temp plastic) materials to suit almost any application in bonding process. We can design and manufacture the tips for die attach of t...

VASM-T/ VASM-TU Pick-up Tool (Bottle Neck Design)

Pick & Place

VASM-Die Pick-up Tool

The decision whether to use a Die Collet or a Pick-up Tool is crucial to the success of the die bonding process and we provide custom tools designed for coping with special die geometries and other process limitations. We can design and manufacture the tips for die attac...

VASM-Die Pick-up Tool

Pick & Place

CL15-C Ceramic Die Collet

Vimic offer Die Collets and Pick-up Tools, manufactured from metallic (nickel alloy, tungsten carbide) and non-metallic (ceramic and high-temp plastic) materials to suit almost any application in bonding process. We can design and manufacture the tips for die attach of t...

CL15-C Ceramic Die Collet

Pick & Place

CL17-TU Tungsten Carbide Die Collet

Vimic offer Die Collets and Pick-up Tools, manufactured from metallic (nickel alloy, tungsten carbide) and non-metallic (ceramic and high-temp plastic) materials to suit almost any application in bonding process. We can design and manufacture the tips for die attach of t...

CL17-TU Tungsten Carbide Die Collet

Pick & Place

SP02-TU Single Pin Adhesive Stamping Tool

Stamping tools are also called as transfer or printing tools, the tools pick up adhesive paste from a tray and stamps the adhesive paste down on to the target pad. Adhesive stamping tools come in various design such as single dot, star, cross a...

SP02-TU Single Pin Adhesive Stamping Tool

Assembly Services

SP02-TU4 Four Pin Epoxy Stamping Tool

Epoxy stamping tools come in various design such as single dot, star, cross and multi-tip and widely used in LED industry because of its simplicity and low cost. We manufacture hard material- tungsten carbide and ceramic materials to fit individual customer's demand in desi...

SP02-TU4 Four Pin Epoxy Stamping Tool

Components

SP02-TU12 Adhesive Stamping Tool (Multi-tip/ Grid)

Adhesive stamping tools come in various design such as single dot, star, cross and multi-tip and widely used in LED industry because of its simplicity and low cost. We manufacture hard material- tungsten carbide and ceramic materials to fit individual customer's demand in design and proc...

SP02-TU12 Adhesive Stamping Tool (Multi-tip/ Grid)

IC Packaging

SP02-TU16 Adhesive Stamping Tool (Multi-pin/ Grid)

Adhesive stamping tools come in various design such as single dot, star, cross and multi-tip and widely used in LED industry because of its simplicity and low cost. We manufacture hard material- tungsten carbide and ceramic materials to fit individual customer's demand in d...

SP02-TU16 Adhesive Stamping Tool (Multi-pin/ Grid)

IC Packaging

SP011-TUS Adhesive Stamping Tool (Custom-made)

Adhesive stamping tools come in various design such as single dot, star, cross and multi-tip and widely used in LED industry because of its simplicity and low cost. We manufacture hard material- tungsten carbide and ceramic materials to fit individual customer's demand in d...

SP011-TUS Adhesive Stamping Tool (Custom-made)

IC Packaging

SP02-TUS Epoxy Stamping Tool (Custom-made)

Epoxy stamping tools come in various design such as single dot, star, cross and multi-tip and widely used in LED industry because of its simplicity and low cost. We manufacture hard material- tungsten carbide and ceramic materials to fit individual customer's demand in desi...

SP02-TUS Epoxy Stamping Tool (Custom-made)

IC Packaging

SP011-TU12 Adhesive Stamping Tool (Custom-made)

Adhesive stamping tools come in various design such as single dot, star, cross and multi-tip and widely used in LED industry because of its simplicity and low cost. We manufacture hard material- tungsten carbide and ceramic materials to fit individual customer's demand in d...

SP011-TU12 Adhesive Stamping Tool (Custom-made)

Components

SP02-TU36 Epoxy Stamping Tool (Multi-pin/ Grid)

Epoxy stamping tools come in various design such as single dot, star, cross and multi-tip and widely used in LED industry because of its simplicity and low cost. We manufacture hard material- tungsten carbide and ceramic materials to fit individual customer's demand in desi...

SP02-TU36 Epoxy Stamping Tool (Multi-pin/ Grid)

IC Packaging

SP07-TU Epoxy Stamping Tool (Multi-tip)

Stamping tools are also called as transfer or printing tools, the tools pick up epoxy from an epoxy tray and stamps the epoxy down on to the target pad. Multi-tip stamping tools are used in large size chip; it is easier to control the glue distribution....

SP07-TU Epoxy Stamping Tool (Multi-tip)

IC Packaging

EN- Ejector Needle

Ejector Pins/ needles are mostly used in die bonding and die sorting process. The needle tip pushes up the die through the expanding adhesive film after dicing for pick up by a collet. Depending on the die size, single pin or more pins (crown needle) are manufacture for various applications...

EN- Ejector Needle

IC Packaging

Non-heated dispensing system

MSD Dry Cabinets