NC258 Lead-Free & Tin-Lead Solder Paste

NC258 Lead-Free & Tin-Lead Solder Paste Description:

Solving the Most Challenging Lead-Free Application Problems

AIM's newest product, its NC258 No-Clean Solder Paste, offers one of the longest pause-to-print windows in the industry and also enhances fine print definitions. Further improving the soldering process, are the NC258's ability to reduce voiding and head-in pillow (reducing rework and rejected board costs) and its superior wetting, which results in bright, smooth, and shiny solder joints.

NC258 also offers very low post-process residues, proven to stay crystal clear even at the higher temperatures required for today's lead-free alloys. And, at room temperature, AIM's NC258 viscosity remains stable over long periods of time.

Halogen-free to Oxygen Bomb EN 14582:2007 SW 9056 SW 5050 and halide-free to IPC J-STD-004, NC258 No Clean Solder Paste is best used within nine months when stored at 4°C–12°C (40°F-55°F) or four months at room temperature.

Features and Benefits of AIM NC258 No-Clean Solder Paste:

• Best-in-class pause-to-print capabilities
• Enhances fine print definitions
• Reduced head-in-pillow
• Reduced voiding
• Excellent wetting, even on lead-less devices
• Lead-free compatible
• Viscosity remains stable over long periods of time at room temperature
• Best printing and most robust solder paste ever developed by AIM

Physical Properties: