WS488 Water Soluble Solder Paste
Company Information:
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WS488 Water Soluble Solder Paste |
Category: |
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Offered by: |
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WS488 Water Soluble Solder Paste Description:
AIM’s WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 offers superior slump resistance, as well as excellent print characteristics and 8+ hours of stencil life. WS488 is compatible with all lead-free alloys and has been developed for use in a wide range of applications.
WS488 Solder Paste Features:
- Excellent Wetting
- Extended Cleaning Window
- Superior Slump Resistance
- Aqueous Wash with Water
- 8 Hour + Stencil Life
- Large Process Window
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Appearance |
Gray, Smooth, Creamy |
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Alloy |
SAC305 |
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Melting Point |
217°C |
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Particle Size |
T3, T4, T5 |
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General Metal Loading |
88.5% (T3) |
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Viscosity |
Print/Dispense Versions Available |
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Packaging |
Available in all industry standard packaging. |
Handling and Storage:
- WS488 has a refrigerated shelf life of 1 year at 4°C (40°F) - 12°C (55°F).
- Allow the solder paste to warm naturally to ambient temperature (8 hrs.) prior to breaking the seal for use.
- Mix the product lightly and thoroughly for 1 to 2 minutes to ensure even distribution of any separated material.
- Do not store new and used paste in the same container, and reseal any opened containers while not in use.
- Replace the internal plug and cap of the 500 gram jars to ensure the best possible seal.
WS488 Water Soluble Solder Paste was added in Jan 2013
WS488 Water Soluble Solder Paste has been viewed 644 times
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