NC259 Lead-Free, Halogen-Free Solder Paste

NC259 Lead-Free, Halogen-Free Solder Paste Description:

AIM is pleased to offer NC259 Solder Paste designed specifically for use with SN100C® and other no- and low-silver alloys.

NC259 is a low-cost, lead-free halogen-free solder paste that offers the performance of tin-lead and high-silver lead-free solder pastes.  Now manufacturers can attain the SMT soldering results they require and pay significantly less per gram than with traditional lead-free solder pastes.  NC259 provides excellent print definition and sustainable solder volume transfer as the demand for smaller pads grows.  Proven to mitigate head-in-pillow defects, NC259 reduces rework and rejected board costs to the manufacturer.  NC259 is formulated to provide one of the longest pause-to-print windows in the industry resulting in less solder waste, fewer restart costs and improved overall quality of prints.  The long stencil life and shelf-life results in far less waste than traditional solder pastes.  The extremely broad process window of NC259 allows assemblers with high density, high mix boards to run without timely set up.  NC259 also offers extremely low post process residues, which remain crystal clear after soldering.

NC259 Solder Paste Features:

• Designed especially for SN100C and low-silver alloys such as SAC0307
• Significant cost savings vs. high-silver alloys without sacrificing quality for reliability
• Excellent print definition and consistent solder volume transfer
• Eliminates defects such as voiding and head-in-pillow
• Reduces graping on ultrafine pads
• Smooth and shiny joints
• Exceptional wetting
• Extremely low residues
• Halogen-free
• Passes IPC SIR 2.6.3.7

Printing:

• Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of 12 to 16 mm (½ to ⅝ inch) is normally sufficient to begin).
• Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry and workable properties.
• NC259 provides the necessary tack time and force for today’s high speed placement equipment, which will enhance product performance and reliability.
• Cleaning of your stencil will vary by application; however, it can be accomplished using AIM DJAW-10 stencil cleaner.

Physical Properties:

Cleaning:

• NC259 can be cleaned if necessary with saponified water or an appropriate solvent cleaner.
• Please refer to the AIM cleaner matrix for a list of compatible cleaning materials.

Handling and Storage:

• NC259 is best used within 9 months at 4° C-12° C (40° F-55° F) or 4 months at room temperature.
• Allow the solder paste to warm up completely and naturally to ambient temperature (8 hrs.) prior to breaking the seal for use.
• Mix the product lightly and thoroughly (1-2 mins. max) to ensure even distribution of any separated material.
• Do not store new and used paste in the same container, and reseal any opened containers while not in use.
• Replace the internal plug and cap of the 500 gram jars to ensure the best possible seal.