Indium Solder Pastes

BP-3106 BGA Bumping Solder Paste

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Specifically formulated for BGA bumping applications

Indalloy 182 Gold-Tin Solder Paste

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For applications that require a high melting temperature (over 150°C), good thermal fatigue properties and high temperature strength. Available in both no clean and RMA formulations

Indium10.1 Pb-Free Solder Paste

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Low voiding on QFN, BGA, and CSP components, exceptional head-in-pillow resistance, eliminates the graping phenomenon

Indium9.72 Die Attach Solder Paste

Ultra-low voiding with minimal profiling, reliable miss-free, clog-free dispensing, consistent dispensing deposit level

Indium9.52 Die Attach Solder Paste

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Low residue, reliable miss-free, clog-free dispensing, consistent deposit size

Indium9.0A Pb-Free Solder Paste

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Eliminates graping phenomenon on small deposits, low voiding in BGA/CSP solder joints

Indium8.9 Pb-Free Solder Paste

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Technology optimized for miniaturized electronics and HIP reduction

Indium8.9E Pb-Free Solder Paste

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Best-in-class for small deposit print transfer efficiency and elimination of graping defects

Indium8.9HF Pb-Free Solder Paste

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Ideal for head-in-pillow and graping elimination, excellent soldering performance under high temperature and long reflow processes

Indium8.9HF SnPb Solder Paste

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Eliminates hot and cold slump, wets well to oxidized BGA and pad surfaces to eliminate head-in-pillow defects

Indium8.9HF-1 Pb-Free Solder Paste

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Combines probe-testability with head-in-pillow elimination

Indium8.9HF1-P Pb-Free Solder Paste

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Excellent soldering performance under high temperature and long reflow processes, excellent wetting

Indium8.9HF1-S3 Solder Paste

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Unprecedented stencil print transfer efficiency to work in the broadest range of processes.

Indium8.9HFA Pb-Free Solder Paste

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Specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems

Indium6.8 Solder Paste

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Ultra-low voiding, superior fine pitch soldering ability, wide humidity tolerance

Indium6.4 Water-Soluble Pb-Free Solder Paste

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Lowest voiding water wash solder paste on the market.

Indium6.3 Water-Soluble Solder Paste

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Water wash technology that possesses industry leading wetting properties

Indium6.2 Water-Soluble Solder Paste

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Ultra-low voiding, superior fine pitch soldering ability, wide humidity tolerance

Indium5.8LS Pb-Free Solder Paste

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Designed for maximum paste print transfer efficiency and elimination of flux spattering

Indium5.7LT Solder Paste

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Low melting point solder paste with high reliability for use in temperature sensitive applications

Indium5.5LT Solder Past

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Low temperature Pb-Free solution, formulated for use with the eutectic 58Bi/42Sn and 57Bi/42Sn/1Ag alloys

Indium5.1 Pb-Free Solder Paste

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Industry leading response-to-pause performance, clear residue, low voiding

Indium5.1AT Pb-Free Solder Paste

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Ultra-low voiding in BGA/CSP components, ultra-low voiding at via-in-pad sites, excellent micro BGA/CSP printability

Indium3.2 Pb-Free Water-Soluble Solder Paste

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Technology for maximizing the process window with long stencil life and strong humidity resistance

Indium3.2HF Water-Soluble Solder Paste

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Halogen-Free version of Indium3.2

Indium3.1 Pb-Free Water-Soluble Solder Paste

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Exceptional printing, long stencil life, outstanding slump resistance, low voiding, low foam

Indium3.1AF Pb-Free Water-Soluble Solder Paste

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Consistent fine-pitch printing performance with high transfer efficiency from stencil apertures, superior fine-pitch soldering ability

NC-SMQ230 Pb-Free Solder Paste

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Minimum peak temperature 229°C, consistent fine pitch print deposition, excellent start-up after idle time

NC-SMQ92 Solder Paste

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Consistent fine-pitch paste deposition, long stencil life and tack time, excellent wetting

NC-SMQ92H Solder Paste

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Modified version of NC-SMQ92J that maximizes print performance.

NC-SMQ92J Solder Paste

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Industry leading solder paste with a soft residue that reduces false failures at ICT.

NC-SMQ92J-UV Solder Paste

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Probe-testable UV fluorescing, post reflow residue, strong initial tack strength and long-term stability

NC-SMQ90 Solder Paste

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Formulated to yield accurate, repeatable dispensing performance on both pneumatic and positive displacement dispensing equipment

NC-SMQ81 Solder Paste

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Designed for use with Sn/Bi and Sn/Bi/Ag alloys, exceptional wetting capabilities

NC-SMQ80 Solder Paste

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Specialty solder paste for low temperature applications with high mechanical reliability

NC-SMQ®75 Solder Paste

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Designed for reflow in a nitrogen atmosphere of 100-ppm oxygen or less.

NC-SMQ57 No-Clean Solder Paste

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Low residue, accommodates low to high humidity conditions

NC-SMQ51SC Solder Paste

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Superior tack strength, exceptional wetting in air reflow, consistent fi ne pitch print deposition

RMA-F Solder Paste

Outstanding slump resistance, excellent wetting compatibility

RMA-SMQ51A Solder Paste

RMA solder paste that meets no-clean requirements. Excellent soldering performance

RMA-SMQ51AC Solder Paste

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Consistent fine pitch print deposition, superior tack strength

WMA-SMQ69HT High Temperature Water Soluble Solder Paste

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Superior humidity and slump resistance, formulated for high temperature alloys