Palomar Technologies
manufacturer of die and wire bonders
Palomar Technologies Postings
4 products »
Automatic Ball Bonder for high pin count devices, complex multichip modules, fine-pitch hybrid microcircuits, ceramic circuit boards,Chip-on-board, and Chip-on-flex....
CBT 6000 Automatic Ball Bonder
High Speed, Large Area (12in x 6in.) Ball bonder with Continuous Bonding Technology....
Deep access wedge bonding for compact hybrids, MCM power connections, Microwave devices, Microwave tuning and lead frames....
3500-II Automatic Component Assembly Cell
Performs pick and place, component placement, adhesive dispense, and flip chip operations....
4 news releases »
Coviant Selects Palomar Technologies to Automate Optical Manufacturing
Jun 19, 2003 | Leading provider of manufacturing services applies
Palomar Introduces New Automatic
May 05, 2003 | Reliable Wire Bonders for High Yield Production
Palomar Technologies Selected as Fiberoptic Product News 2002 Technology Award Winner
Apr 16, 2003 | Award presented for Palomar's Gold Connection
Palomar Names VP of Sales and Product Support
May 09, 2002 | Palomar Technologies Inc. has Promoted Jeffrey M. King