RO300FC Full Convection Reflow Oven

RO300FC Full Convection Reflow Oven Description:

Small but powerful reflow oven. 300 mm process width. Sophisticated zone separation between zones enables profiles that are normally possible only on larger and much more expensive systems. Small footprint 2.0x0.7 m.

• 4 zone convection
• 300 mm soldering with
• Lead-free process approved
• Soldering or curing

Hot air convection oven for all SMT applications

The RO300FC exclusively heats with hot air convection and can be used for the different tasks in SMT assembly, especially for the reflow soldering of lead free solder pastes or the curing of adhesives. It features easy operation, perfect reflow results and a robust construction. It is well suited for continuous production, small batch manufacturing and prototyping.

• 100% convection heating
• Equal heating rates
• Minimum Delta-T
• Precise temperature control
• Soldering or curing applications
• Small dimensions – high throughput
• Volume or small series production
• Graphical recording of temperature profiles