SMT Equipment

PACE TF 1800 BGA/SMD Rework System for Standard Boards (up to 12" x 12")

Company Information:

A recognized developer of solutions for the assembly & repair of highly advanced electronics. PACE provides products/training for the soldering, rework & repair of pcb's, specializing in BGA rework, desoldering & fume extraction.

Vass, North Carolina, USA

Manufacturer, Standards Setting / Certification, Training Provider

  • Phone 910-695-7223
  • Fax 301-490-0193

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PACE TF 1800 BGA/SMD Rework System for Standard Boards (up to 12

PACE TF 1800 BGA/SMD Rework System for Standard Boards (up to 12


PACE TF 1800 BGA/SMD Rework System for Standard Boards (up to 12" x 12")


Rework & Repair Equipment

Offered by:

PACE Worldwide


PACE TF 1800 BGA/SMD Rework System for Standard Boards (up to 12" x 12") Description:

Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance

Conventional resistance coil heating technology has been successfully used in convective rework stations
for decades to install and remove a variety of BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom
terminated components. However, today’s extremely high thermal mass boards, ultra-fine pitch components
and challenging production rework environments demand greater process control, thermal performance and
faster throughput than ever before. Enter PACE’s TF 1800 BGA/SMD Rework System. With its ground-
breaking, patented Inductive-Convection Heating Technology, the TF 1800’s top-side heater reaches
the target temperature in just seconds for safe, rapid solder joint reflow in virtually any component installation
or removal application.

TF1800 BGA Rework System

How Inductive-Convection Heating Works

The TF 1800’s  Inductive-Convection Heating Technology provides ultimate thermal performance by its ability
to instantly heat up and cool down the temperature of the air it delivers to the work.

PACE Patent-Pending Inductive-Convection Heater Technology

1.) The air is first pre-heated in the outer heater chamber as it moves in a cyclonic fashion around the induction coil
before it enters the inner chamber.  2.) After entering the inner chamber, the pre-heated air is then heated to target
temperature through a highly efficient heat transfer process in an energized induction field. 3.) During active cooling,
the induction coil is de-energized and the TF 1800 delivers fast, controlled, active cooling of the component and PCB
directly through the nozzle, eliminating the risk of excessive intermetallic growth and yielding the highest quality
solder joints.

Powerful, Energy Efficient Performance

The TF 1800’s Inductive-Convection Heating Technology delivers all the power you need to tackle the most challenging
high thermal mass PCBs available today. Yet, its highly-efficient design does it with just a fraction of the power required
by yesterday’s conventional heating technology.

Advanced Features

Exploded features of PACE TF 1800 BGA Rework System

  • Ultra-High Precision Placement Capability: Newly designed motorized reflow head is driven by an advanced stepper
    motor system which provides smooth, high precision, repeatable movement with no drift, allowing for soft landing of
    components and 28µm (.0011") placement accuracy.
  • High Sensitivity Vacuum Pick Assembly: New Vacuum Pick design is more robust, utilizes an optical sensor, is
    counterweight balanced, and uses precision high temperature linear ball bearings for the highest sensitivity in placement
    and pick-up. Includes 7 Vacuum Picks.
  • PACE Exclusive Height Adjustable Bottom-Side Preheater: High powered medium/long wave quartz IR heating elements
    respond faster with 1000W of power. The preheater height is adjustable from standard position up to 38mm (1.5") closer
    to the PCB for the most challenging high thermal mass boards.
  • Integrated Board Support Wand: An innovative Board Support Wand prevents warping or sagging during reflow, is
    extremely adjustable to clear parts on the bottom of PCB, and is easily removed when not in use.
  • High-Definition Optical Alignment System: An automated Vision Overlay System uses a beam-splitting prism for
    simultaneous view of PCB pads and balls, high intensity LEDs for shadow-free lighting, and new high definition 1080p
    camera to easily align any component.
  • Crisp & Clear Images for Component Alignment: A high definition Vision Overlay System uses bright white LEDs with
    independent intensity control and up to 240x zoom capability to provide precise distinction of pads and solder ball or leads.
  • Quad-Field Imaging for Large/Fine Pitch BGA's: Quad-Field Imaging allows up to four corners of a large component (and its
    pads) to be viewed under high magnification, providing perfect alignment of outsized BGAs or fine-pitch QFPs.
  • Fourth Generation Software Suite: Newly designed Windows-based software provides a simple graphical interface with
    intuitive set-up and profiling, on-the-fly profile adjustment, unlimited profile storage and much more.
  • LIMITED TIME OFFER - 5 Free Heat Focusing Nozzles: For a limited time, we will provide 5 Nozzles free of charge with
    the purchase of each TF 1800 System, a value of over $1,700/£1,350/€1,660! Over 90 standard nozzles are optionally available
    for BGA, CSP, QFP, SO, QFN and other components. Custom designs can be created to meet specific rework requirements.
  • Proudly Made in the USA

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PACE TF 1800 BGA/SMD Rework System for Standard Boards (up to 12" x 12") was added in Mar 2017

PACE TF 1800 BGA/SMD Rework System for Standard Boards (up to 12" x 12") has been viewed 1150 times

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