SMT Equipment

MALCOM TK-1 Tackiness Tester

Company Information:

Seika Machinery provides electronics manufacturers with advanced machinery, superior materials and engineering services including Automated Test Equipment, SMTA assembly equipment and QA products

Torrance, California, USA

Distributor, Manufacturer

  • Phone 310-540-7310
  • Fax 310-540-7930

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MALCOM TK-1 Tackiness Tester

MALCOM TK-1 Tackiness Tester


MALCOM TK-1 Tackiness Tester


Solder Materials

Offered by:

Seika Machinery, Inc.

MALCOM TK-1 Tackiness Tester Description:

The Malcom TK-1 Tackiness Tester is widely used to help our customers predict solder paste tack time, limiting the potential for dropped components, using either the IPC, Depth Method, or JIS Standard Test. These three convenient testing methods for tackiness allows you to determine component drop time to loss of adhesion, and thus avoiding costly rework. Tackiness refers to combined force of the cohesion and adhesion. In many cases, chip parts are held on the board by the paste's tackiness during reflow. It is at this time that defects occur from chips falling off the board; or being displaced by the vibration of the chip mounter after some time has elapsed, since printing or when tackiness is reduced by reflow heat.


  • Quantifies solder-paste tackiness.
  • Determines component drop-time, thus reducing costly rework.
  • Three testing methods available.
  • User-variable measurement conditions (time, preload, depth, and speed).
  • Digital display of measured tackiness, real preload, and real insertion depth.
  • Online computing capable with included PC software.

MALCOM TK-1 Tackiness Tester was added in Feb 2018

MALCOM TK-1 Tackiness Tester has been viewed 704 times

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